OPTOLINQ TMC-2100| Transparent Mold Compound
- Exceptional moldability with long spiral flow
- Low moisture absorption
- Excellent reliability
Product Description
OPTOLINQ TMC-2100 is an optically clear epoxy molding compound specifically designed for the encapsulation of optoelectronic devices. With its high spiral flow, it ensures precise and intricate molding.
OPTOLINQ TMC-2100 offers excellent moisture resistance, maintaining performance even in high temperature and humidity conditions. TMC-2100 stands out with its superior moldability and reliability, ensuring good quality and precision in optoelectronic device molding.
Technical Specifications
General Properties | |||||||
Color Color The color | Transparent | ||||||
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.25 | ||||||
Physical Properties | |||||||
Spiral Flow @ 175°C | 80-180 cm | ||||||
Mechanical Properties | |||||||
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Thermal Properties | |||||||
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Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 120 °C |
Additional Information
Property | Value | Unit |
Specific gravity | 1.20–1.25 | – |
Hardness at 25 °C | 80 | Shore D |
Gel time at 150 °C | 35–60 | s |
Spiral flow at 150 °C | 80–180 | cm |
Mold shrinkage | 1.5 | % |
Glass transition temperature by TMA | 120±10 | °C |
Coefficient of thermal expansion, α1 | 60–100 | ppm/K |
Coefficient of thermal expansion, α2 | 170–210 | ppm/K |
Flexural strength | 110 | MPa |
Flexural modulus | 2.6–3.4 | GPa |
Transmittance at 400 nm | >85 | % |