Tara Tubbs & Philip Procter September 1994 Abstract Adhesion of the mold compound to its substrates has received increasing attention over the past few years. In these studies, the...
Popular
CHEMLINQ MRE-C909 | Carnauba Wax Mold Release Spray
- » Alternative to MJ Gordon #909C
- » Carnauba wax mold release Spray
- » Compatible with Epoxy Mold Compound
Contact for pricing
Popular
LINQCELL GDL1900 | 1.9mm Carbon Plate
- » 1.9mm - 1900um - 74.8mil
- » Alternative to 7590
- » Graphitized Carbon Plate
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Popular
LOCTITE ECCOBOND UF 9000AE
- » Low die warpage
- » Best large die underfill
- » 260°C reflow capability for Pb- free, low-k applications
Contact for pricing
Just released
MCP-5260 | Motor Coating Powder
- » Light Green Color
- » Good Edge Coverage
- » Insulation Class F
Contact for pricing
Sale
XVCF-3.5S200 | LINQSTAT 3.5 mil - 200 Ω/sq Conductive Film
- » 3.5 mil - 89um - 0.09mm
- » ±200 Ohms/sq Surface resistivity
- » ±25 ohms-cm Volume resistivity
$77.99
$59.99
In stock
PTM 7000-SPM | Phase Change Paste
- » 0.06 Thermal Impedance
- » 6.5 Thermal Conductivity
- » Medium drying solvent
Contact for pricing
New
FM-0815J | Reactive PDMS - Monoterminal Alkoxysilyl
- » Mono terminal
- » 3,000 g/mol | 26 mPas
- » Alkoxysilyl functional group
Contact for pricing
Just released
OPTOLINQ GT-W170 | White Epoxy Mold Compound
- » Reflective compound
- » Replaces Kyocera KE-96/95
- » Oxidation resistance
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Get it
GCP 1805 | Halogen-free Insulating Epoxy Coating Powder
- » Blue and Gold Colors
- » Halogen-free Epoxy Coating Powder
- » For class 2 & 3 capacitors and varistors
Contact for pricing
Get it
PIT0.5S-UT-RL | 0.5-mil Polyimide (Kapton) Tape | Ultra-Thin Silicone Adhesive with Release Liner
- » 0.5 mil polyimide film
- » Silicone adhesive
- » >1500V breakdown voltage
$91.69
$70.53
New
BCP-1507 | Medium voltage Busbar Coating Powder
- » Orange Color
- » All around usage
- » RTI Class B
Contact for pricing
Learn more
LOCTITE STYCAST OS5101
- » UV Cure
- » Optoelectronics assembly
- » Low CTE and moisture absorption
Contact for pricing
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Tara Tubbs & Philip Procter September 1994 Abstract Adhesion of the mold compound to its substrates has received increasing attention over the past few years. In these studies, the...
The information technology industry has experienced exponential growth in the performance of computer systems over many decades, which has been mainly driven by the scaling of the transistor to...
We are delighted to welcome James Baduria to the CAPLINQ family as our new Application Engineer based in the Philippines. James will specialize in Molding Compounds and Optoelectronic Encapsulants,...