Potting materials

	Operating temperature (°C)	Thermal conductivity (W/mk)	Cure time	Hardness
PM-1211	-60 - +200	0.3	24hrs (25°C)	10-30 (Shore A)
PM-1221	-60 - +150	>0.6	36hrs (25°C)	70-100 (Shore A)
PM-1231	-40 - +90	0.3	48hrs (25°C)	80 (Shore D)
PM-1231BK	-40 - +90	0.7	48 hrs (25°C)	>80 (Shore D)
PM-2632	-	-	24hrs (25°C)	70-75 (Shore D)
PM-4911	-	-	12hrs (25°C)	-
PM-4911HV	<250	0.4	12hrs (25°C)	-
PM-PU111	-	-	96-120hrs (25°C)	85 (Shore A)
PM-PU211	40 -130	0.6	24hrs (25°C)	60-70 (Shore D)
PM-PU514	-	0.75	10-12HRS (35℃)	60-70 (Shore D)
PM-SI611	-40 - +200	>1.0	1.3 - 1.8hrs (30°C)	50-60 (Shore A)
PM-WD310	-	0.3	1 hr at 80°C	-
BS-610-2	---

Epoxy

Epoxy potting materials are widely favored for their exceptional mechanical strength and adhesion properties. They form robust bonds with various substrates, providing excellent protection against moisture, chemicals, and mechanical stresses. Epoxy-based potting compounds offer superior thermal conductivity, making them ideal for applications where heat dissipation is critical, such as power electronics. Additionally, their low coefficient of thermal expansion (CTE) ensures dimensional stability under fluctuating temperatures. These characteristics, coupled with their ease of processing and versatility, make epoxy potting materials a popular choice for a wide range of electronic and industrial applications.

Silicone

Silicone-based potting materials are renowned for their outstanding flexibility and thermal stability. These materials maintain their integrity across a broad temperature range, making them suitable for extreme environmental conditions encountered in automotive, aerospace, and outdoor applications. Silicone potting compounds exhibit excellent resistance to moisture, chemicals, and UV radiation, ensuring long-term reliability in harsh environments. Their low viscosity allows for easy dispensing and complete impregnation of complex electronic assemblies, ensuring thorough encapsulation and protection against environmental contaminants. Moreover, silicone potting materials are inherently non-conductive and exhibit good dielectric properties, making them ideal for insulating sensitive electronic components.

Potting and encapsulation for printed circuit boards

Acrylic

Acrylic-based potting materials offer a versatile solution for encapsulating electronic assemblies in challenging environments. These compounds feature fast curing times and simple processing, enabling high-throughput production with minimal downtime. Acrylic potting materials provide good adhesion to a wide range of substrates, ensuring secure encapsulation and protection against moisture, dust, and chemicals. Their low shrinkage during curing minimizes internal stresses, reducing the risk of delamination and cracking in encapsulated components. Acrylic potting materials also offer excellent electrical insulation properties, maintaining signal integrity and preventing electrical failures in sensitive electronic circuits. These characteristics make acrylic potting materials well-suited for applications such as consumer electronics, LED drivers, and renewable energy systems.

Urethane

Urethane potting materials offer a balance of mechanical strength, flexibility, and chemical resistance. These compounds provide robust protection against moisture ingress, corrosion, and mechanical impact, making them suitable for applications exposed to harsh operating conditions. Urethane potting materials cure rapidly at room temperature or with mild heat, facilitating efficient processing and shorter production cycles. Their excellent adhesion to various substrates ensures secure encapsulation of electronic components, preventing moisture-induced failures and enhancing long-term reliability. Furthermore, urethane potting materials exhibit good resistance to abrasion and thermal shock, making them suitable for demanding applications such as automotive electronics, industrial sensors, and outdoor lighting fixtures.

Flexibility vs. Mechnical Strength

Temperature Resistance

Element	Definition
Resin	A naturally occurring or synthetic compound that solidifies through treatment. Its classification varies based on chemical composition and potential applications.
Hardener	This substance (or blend) initiates the polymerization process with the resin. During this chemical reaction, the hardener is consumed and integrates fully into the polymer structure.
Filler	Typically inert, fillers are incorporated into the resin/hardener mixture to achieve desired properties such as thermoshock resistance, density, and dielectric properties.
Adhesive	Various types of additives serve different functions based on requirements. Additives may include (reactive) diluents, anti-foaming agents, adhesion promoters, pigments, etc.