PM-SI611 | Silicone Potting material


Main features
  • High temperature resistance
  • High flowability
  • Void free casting

Product Description

LINQBOND PM-SI611 is a two-part, grey RTV silicone potting material designed for various applications like electrical potting, PCB encapsulation, LED drivers, cable joining, and surge protection. It offers excellent high-temperature performance and easy reworkability, making it durable and adaptable.

LINQBOND PM-SI611 low viscosity ensures smooth flow, deep penetration, and void-free encapsulation of intricate components. The formula reduces porosity, resulting in strong, reliable castings. Additionally, PM-SI611 has built-in fire-retardant properties, adding safety to critical applications.

Applications:

  • Electrical Potting
  • PCB Encapsulation
  • LED Driver Potting
  • Cable Joining
  • Surge Protection Device

Product Features & Benefits:

Unmatched High-Temperature Performance & Re-workability: LINQBOND PM-SI611 stands out by offering a rare combination of high-temperature resistance, ensuring reliability in extreme conditions, coupled with excellent re-workability, allowing for easy component repair or replacement, saving time and resources.

Superior Safety & Compliance (UL94 V-0): With its UL94 V-0 flammability rating, this potting material provides an exceptional level of fire safety, exceeding industry standards and ensuring protection for critical applications and peace of mind for users.

Streamlined Processing for High-Volume Manufacturing: The low viscosity and machine pourability of LINQBOND PM-SI611 make it ideal for automated dispensing, facilitating efficient and cost-effective high-volume production while maintaining consistent quality and performance.

Product Family
PM-SI611  
30kg Bucket - Part B 30kg Bucket - Part A

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time at 30 °C 30-50 sec
Mix Ratio
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
 1:1
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 25°C 183 days
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 2000-3000 mPa.s
Chemical Properties
Moisture absorption 0.2 %
Electrical Properties
Breakdown Voltage
Breakdown Voltage
Breakdown voltage is the minimum voltage necessary to force an insulator to conduct some amount of electricity.
It is the point at which a material ceases to be an insulator and becomes a resistor that  conducts electricity at some proportion of the total current. 

After dielectric breakdown, the material may or may not behave as an insulator any more because of the molecular structure alteration. The current flow tend to create a localised puncture that totally alters the dielectric properties of the material.

This electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film.
 24 V
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 4.2x1013 Ohms⋅cm
Dielectric Constant
Dielectric Constant
Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current.

It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material.

The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator.

It is a dimensionless property that can be affected by various factors such as the
thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.
Dielectric Constant @ 25 ˚C/1000 kHz 4
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore A) 50-60
Thermal Properties
Operating Temperature -40 to 200 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 >1.0 W/m.K
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V-0
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Time 80-110 min

Additional Information

Processing Instructions

 

  1. Before mixing, stir both Part A and Part B to homogenize. 

  2. Mix components A and B according to the specified weight ratio. Stir thoroughly to ensure uniformity while preventing air from introduced into the mixture. Ensure contamination is avoided. 

  3. To ensure complete mixing of both parts, machine mixing and dispensing are recommended. Static  and dynamic mixer can also be used for mixing.

  4. Degas the mixture to remove the bubbles for about 10 minutes. Do not fill the container more than half full to prevent overflowing during degassing.

  5. Gradually pour the mixed compound into the device being potted. 

  6. Allow the potted workpiece to cure. The curing process is influenced by temperature variations; generally, higher temperatures result in faster curing, while lower temperatures lead to slower curing. 

Packaging

LINQBONDTM PM-SI611 Part A and Part B is available in 30 kg open top plastic buckets. 

 

Storage and Handling

Store in a ventilated, dry, and clean environment at 30±5 °C. Keep away from fire and heat sources. It is strictly forbidden to store in outdoor environments. At proper storage conditions, both Part A and Part B have a shelf life of 6 months.