Adhesives

General and Industrial applications

SMP, PUR, Hotmelt

Adhesives

Adhesives are essential bonding solutions used across industries to hold materials together and resist separation. Caplinq's adhesives are engineered to deliver superior performance and ease of application across various industries. Our comprehensive bonding solutions, including epoxy, acrylic, cyanoacrylate, polyurethane, silicon, and hybrid adhesives, cater to diverse needs from electronic, automotive, and other industrial engineering.

We offer options tailored to your specific application, including different curing methods such as UV-curing, temperature-curing, one-part or two-part adhesive, various viscosity range, etc. Our products boast exceptional adhesion, flexibility, and resistance to chemicals and environmental factors, ensuring reliable performance even in the most demanding conditions.

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Product Selector Guide

Silyl-modified polymers (SMP)

Product Application Curing mechanism Skin time Open Time Tensile strength (MPa) Elongation (%) Product features
BS-2000 V112 Bonding/gap filling Moisture Curing - - 1.15 9.2 High thermal conductivity
BS-6000 V101 Bonding Moisture Curing - 7.74 - 241 High Modulus elastic adhesive
BS-7000 V3 Bonding/gap filling Moisture Curing 10 <15 2.0 250 General purpose sealant with low residual tack
BS-7000F V3 Bonding/gap filling Moisture Curing 10 <15 3.0 200 Meets the highest hazard level 3
BS-7000 V7 Bonding/gap filling Moisture Curing 30 - 1.5 -  low viscous
sprayable sealant, with a special spray structure for sealing overlapping
seams
BS-7000 V8 Bonding/gap filling Moisture Curing 15 <15 2.9 250 Developed for the rapid and efficient bonding
of windscreens

Polyurethane

Product Application Curing mechanism Mixing ratio Shear strength (MPa) Tensile strength (psi) Elongation (%) Product features
BS-9000 V303 Bonding Moisture Curing 1:1 14 16 14 Good adhesive performance with FRP, Composite material, metal and plastic

Hotmelts

Product Application Curing mechanism Mixing ratio Mixed viscosity (MPa) Tensile strength (psi) Elongation (%) Product features
BS-1000 V8 Bonding Moisture Curing 1:1 375000 1.8 315% Fast room-temperature curing silicone for durable electronics

Frequently Asked Questions

Frequently asked questions about Adhesives

What is structural Adhesive?

Structural adhesives are specialized adhesives designed to bond materials together under mechanical stress. They are used in applications where the bond is expected to withstand forces such as tension, shear, or peel and provide long-lasting and durable bonds that can withstand significant loads.

Is SMP technology compatible with plastics such as PMMA, PC, ABS?

Our SMP technology is compatible with plastics such as PMMA, PC, ABS. It has been tested and approved globally and is popular among plastic producers.

What is the recommended bondline thickness for SMP technology?

The bondline thickness could work with a minimum of 2 mm thickness. This thickness impacts the elastic bonding properties of the SMP technology, so we recommend 20 mm for ideal elastic bonding properties.

What are the differences between one-component and two-component polyurethane applications in terms of curing?

Compared to 1 part PU, 2 part PU can cure more quickly and is not dependent on moisture or heat to cure, ambient temperature will do the justification.  

Generally, the two-component polyurethane can be cured at room temperature at a certain curing time and one-component polyurethane cures typically by moisture reaction.

What is the difference between viscosity and rheological index? 

Viscosity is a measure of a fluid's resistance to flow. It essentially describes how thick or sticky a fluid is. A fluid with high viscosity flows slowly, while a fluid with low viscosity flows easily. The rheological index, on the other hand, is a dimensionless number that indicates how the viscosity of a fluid changes with the shear rate. This means it describes how the fluid's thickness changes when it is subjected to different levels of force.


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Adhesive core benefits

Adhesives offer various benefits in various industries, including electronics, automotive, construction, and manufacturing.

adhesive core benefits

High mechanical strength: Structural adhesives can achieve very high bond strengths, often exceeding those of mechanical fasteners

Material Bonding: Adhesives create strong and durable bonds between different materials, providing structural integrity and stability.

Uniform stress distribution: Adhesives can distribute stresses more evenly across bonded surfaces, reducing the risk of failure.

Aesthetics: Adhesives and sealants can be used to create clean, seamless joints, improving the appearance of products.

Lightweight: Adhesives can often be used to replace mechanical fasteners, resulting in lighter and more efficient products.

Effectiveness: Adhesives can often be applied more efficiently than mechanical fasteners, reducing labor costs and streamlining production processes, leading to increased productivity.

Corrosion protection: Adhesives can provide a protective barrier against corrosion, especially in applications exposed to harsh environments.

Impact resistance: Adhesives can create strong and durable bonds between materials, enhancing their ability to withstand external shocks and forces

Vibration damping: Some adhesives can absorb vibrations and reduce noise, improving product performance and comfort.

Failures model

The adhesive failure model refers to how an adhesive bond breaks under stress. Analyzing these failures helps understand factors affecting bond strength, leading to better bonding processes, adhesive selection, and durable joints

 

Adhesion Failure occurs at the interface between the adhesive and the substrate. It indicates that the bond between the adhesive and the substrate was weaker than its strength. We suggest improvements such as the surface preparation and adhesion properties.
Cohesive Failure occurs within the adhesive itself. It Indicates that the adhesive is weaker than the materials it's bonding and we suggest the adhesive couldn't withstand the applied stress.
Mixed Mode Failure combines both cohesive and adhesive failures, breaking partly within the adhesive and partly at the interface. And indicates a combination of factors affecting bond strength, such as surface preparation, adhesive properties, or application conditions.
Substrate Failure occurs in the inner of the substrate. It indicates that the bond between the adhesive and the substrate, the cohesion of the adhesive was stronger than the material strength.

Common Adhesive Stresses

Understanding these stress types is essential for selecting the right adhesive and designing durable joints. Knowing how different adhesives respond to various stresses ensures optimal performance and reliability in multiple applications. 

Tensile stress is a pulling force applied uniformly across the entire adhesive joint. This force acts directly away from the bond line, in a straight, in-plane direction. The force is distributed evenly over the entire bonded area.
Shear stress is a force applied parallel to the adhesive bond, causing the substrates to slide past each other. This force acts in the same plane as the bond line and is evenly distributed across the bonded area.
Cleavage is a type of stress where a force is concentrated at one edge of an adhesive joint, creating a prying action. This concentrated stress at one end of the joint. Cleavage typically occurs when both substrates are rigid.
Compression is a force applied directly toward the adhesive bond, acting in a straight, in-plane direction. Like tension, the force is evenly distributed across the bonded area.
Peel stress is a force applied at one edge of an adhesive joint, causing a peeling action. Unlike cleavage, peel stress involves a flexible substrate, which concentrates the force even more at the edge, making it a more demanding test of the adhesive's strength.

Curing Machemnism

UV-curing

UV-curable materials contain photoinitiators that are activated by UV light. When exposed to UV radiation, these photoinitiators undergo a chemical reaction that initiates the polymerization process, causing the adhesive to solidify.  UV-curing adhesives such as epoxy acrylate adhesives, polyurethane acrylate adhesives, and polyester acrylate adhesives are widely used.

It brings fast curing times, less energy consumption, environmental friendliness, and accurate and consistent results

Moisture-curing

Moisture-curing adhesives typically contain reactive groups, such as isocyanates or hydroxyl groups, that can react with water molecules. When exposed to moisture, these reactive groups undergo a chemical reaction, forming new bonds that solidify the adhesive.  It brings the disadvantages of ease of application, does not require special equipment or curing conditions, and is environmentally friendly. Common types of moisture-curing adhesives include Polyurethanes, Silicones, and Cyanoacrylates. 

Heat-curing

Heat curing is a process where adhesives solidify when exposed to heat. This heat energy activates reactive groups within the material, causing them to undergo a chemical reaction that forms a polymer network. Most heating curing adhesives are supplied in a two-component system, usually made up of a resin and a hardener, there are also some adhesives are supplied in single-component systems or one-component systems. In this system, the heat-curing pastes must be cold-stored to delay the curing itself.  Epoxies are a class of the most common heat-curing adhesives, polyester resin, and phenolic resins.

 

 

Adhesives Introduction