BS-2000 Series | Silyl Modified Polymers (SMP)


Main features
  • High Temperature Gap Filler
  • Silicone-Free & Silyl Modified Polymer (SMP) Chemistry
  • Stable thermal performance during Aging test

Product Description

BS-2000 is a high-performance, silicone-free, dual-component gap filler specifically designed for efficient thermal management in electronics and automotive applications. BS-2000 is ideal for filling and leveling gaps between heat-generating components and cooling plates, ensuring optimal heat dissipation and enhancing the longevity and reliability of your devices.

BS-2000 features SMP (Silyl Modified Polymer) chemistry, which significantly enhances adhesion throughout its entire service life. Unlike silicones or polyurethanes (PUs), the thermal resistance of this material improves over time, allowing for the use of lower initial thermal conductivity values without compromising long-term performance. This ensures consistent and reliable thermal management, making it an ideal choice for reliability demanding applications.

Product Family
BS-2000  
BS-2112 290ml cartridge

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 6 - 8 weeks Shipping in 6 - 8 weeks Shipping in 6 - 8 weeks

Technical Specifications

General Properties
Chemistry Type SMP
Density (g) 2.45 g/cm3
Filler Content Non-abrasive ceramic filler %
Mix Ratio
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
10:1
Pot Life
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
0.5 hours
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
0.000130 mPa.s
Electrical Properties
Dielectric Strength
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.

Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.

As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
≥10 kV/mm
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.0x1011 Ohms⋅cm
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore A) 80
Elongation
Elongation
Elongation is the process of lengthening something.

It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.

It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
9.2 %
Shear strength
Shear Strength 1.6 N/mm2
Tensile Strength
Tensile Strength
The tensile strength of a material is the maximum amount of tensile stress that it can withstand while being stretched or pulled before failure.

Some materials break very sharply, without plastic deformation, in what is called a brittle failure. Others, which are more ductile, including most metals, experience some plastic deformation and possibly necking before fracture.
Tensile Strength
Tensile Strength
Tensile strength determines the resistance of a material to break under tension and it measures how much elongating load (or tensile stress) it can handle before fracture.

To make it simple, it measures how much force we have to apply when pulling apart a material before it breaks.
1.15 MPa
Thermal Properties
Operating Temperature 150 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
≥ 2.0 W/m.K

Additional Information

  • Simple processing using dispensing equipment customized cartridges.
  • Ease of automation process
  • Processing at elevated temperature (60 ℃) decreases viscosity which enables excellent dispensing properties
  • The material can be removed in a non-crosslinked state by simple wiping, and with commercially available solvent/cleaners
  • Crosslinking occurs 24h after mixing.

 

BS 2000 Series Reliability Test Data Results