Thermal Putty pads

High Compressibility and Thermal Conductivity

AVAILABLE DIRECTLY AT CAPLINQ.COM

Phase Change Materials Thermal Gap Pads Thermal putty pads Two Part Hybrid One Part Hybrid Thermal Grease Thermal Insulators

Thermal putty pads

Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances.

Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink. Putty pads combine ultra soft - high compressibility with a low surface impedance that is complemented by natural tackiness and ease of application.

Typical applications for putty pads can be found in EV battery & charging stations, automotive electronics, power devices & modules, telecommunications & network servers.

Thermal putty pads are available in thicknesses ranging from 0.5mm to 5.0mm.

Overview

FAQs

Compare
TGP 3510PT | Thermal Putty Pad
- 0.45 Thermal Impedance
- 3.5 Thermal Conductivity
- 0.5 - 5 mm Thickness
6 - 8 weeks
Compare
TGP 6000PT | Thermal Putty Pad
- 0.27 Thermal Impedance
- 6.0 Thermal Conductivity
- 0.5 - 5 mm Thickness
6 - 8 weeks
Compare
TGP 8000PT | Thermal Putty Pad
- 0.19 Thermal Impedance
- 8.0 Thermal Conductivity
- 0.5 - 5 mm Thickness
6 - 8 weeks

Thermal Putty Pads
Product name	Color	Thickness (mm)¹	Hardness (Shore00)	Specific Gravity	Thermal Conductivity (W/m·K)	Thermal Impedance(˚C·in²/W)(1mm@10psi)	Dielectric Constant @1MHz	Volume Resistivity (ohm·cm)	Flammability Rating
TGP 3500PT	Green	0.5-5	5	3.2	3.5	0.45	6.4	4.0 x 10¹³	V-0
TGP 3510PT	Green	0.5-5	5	3.2	3.5	0.45	6.4	4.0 x 10¹³	V-0
TGP 6000PT	Grey	0.5-5	5	3.4	6.0	0.27	6.5	4.0 x 10¹⁵	V-0
TGP 8000PT	Grey	0.5-5	5	3.5	8.0	0.19	8.5	4.0 x 10¹⁵	V-0

What are some typical Thermal putty pad applications?

Typical Thermal Grease Applications include:

EV Battery & Charging stations
Automotive electronics
Power devices and modules
Telecommunication & network servers

What are the benefits of Thermal putty pads?

The material’s putty like design makes it ultra soft and compressible and enables excellent gap filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators during high volume assembly.

The hardness is completely different compared to gap pads. Putties are soft and require little to no pressure, something that makes them good replacements for thermal gels. They are non electrically conductive and come in large form factors they work great if properly handled.

Additionally, they are naturally tacky and require no additional adhesive to mate the heat source and heat sink.

Thermal Putting Pad V.S. Thermal Gap Pad

Standard thermal gap pad materials have tensile strength, but little elasticity. Standard gap pads and putty gap pads have essentially the same performance for a given gap. The compression behaviour differences are:

No tensile strength and no elasticity

They can be pulled apart very easily and are applied in the same manner as a gap filler pad. The compression is 100%.
They do not bounce back. It’s important to ensure two good surfaces that will not move if using putty pads.

Compress down significantly

They require a minimum amount of compression; at least 10%.They are soft, and eventually they will bottom out past 80%.
They also relax over time. what’s referred to as densification. The material is no longer flowing and is being crushed. Make sure not to exceed a certain amount of force when using these materials.

Thermal putty pads and thermal gap pad are similar products. For example, TGP8000 and TGP8000PT both have high thermal conductivity as 8 W/m.K and need at least 10% compression while applying. The main difference is that thermal putty pads are ultra-soft and could be compressed up to 90%. It almost has no tensile strength and no elasticity, thus will not recover and bounce back. Due to the low stress and high compressibility, thermal putty pads are more suitable for applications with large dimensional variances, comparing with traditional thermal gap pad.

Thermal Putty Pad V.S. Thermal Gap Pad

Both thermal putty pad and thermal hybrid gel belongs to gap filler type TIM, which are applicable for large bone line thickness application (>0.5mm). Thermal gel products are designed for automation process such as dispensing. Compared with hybrid gels, putty pads are suitable for large area assembly. It is easy to apply thermal putty pads manually and there is no needs for dispensing equipment.