TGP 8000PT | Thermal Putty Pad

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

Main features

0.19 Thermal Impedance
8.0 Thermal Conductivity
0.5 - 5 mm Thickness

Product Description

Honeywell TGP 8000PT Thermally Conductive Putty Pads provide high thermal performance and excellent thermal reliability (8 W/mK). The material’s putty-like design enables excellent gap-filling capability for applications with large dimensional variances within surfaces. Special surface reinforcement enables easier handling for operators during high volume assembly. Pads thicker than 0.5mm come contained and reinforced within single sided fiber glass and dual liners.

Honeywell TGP 8000PT is naturally tacky and requires no additional adhesive to mate to heat source and heat sink. This product can be used for unbalanced mounting pressure applications while also improving dripping and pump out, compared to thermal grease. It is available in thicknesses ranging from 1.0mm to 5.0mm. With 10~70% compression, the final BLT could reach a minimum of 0.5mm.

Learn more When should you choose thermal putty pad over thermal gap pad and thermal gel.

Available Versions:

TGP8000PT/01, single-side fiberglass reinforced version
TGP8000PT/00, no fiberglass reinforced version
Properties customization possible (compression-deflection, breakdown voltage)
Die-cut shapes possible

Key Features:

Low thermal impedance and UL94 V-0 listed
BLT (bond line thickness) from 1mm to 5mm
Natural tacky to the heatsink and heat source
Ultra-soft (shore00, 5) with high compressibility and low stress generated
Suitable for applications with large dimensional variances
Minimum bleeding and pump out controlled

Highly Recommend For:

Automotive/consumer electronics, PCB
Power device & modules
Telecommunications & network servers
Semiconductors logics & memory
EV battery & charging station

Product Family
TGP8000PT

1. Select Package Type

400 x 400 x 1.0mm Pad

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 6 - 8 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Gray

Film Thickness

1 - 5 mm

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

3.5

Electrical Properties

Dielectric Constant

Dielectric Constant
Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current.

It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material.

The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator.

It is a dimensionless property that can be affected by various factors such as the thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.

Dielectric Constant @ 1000 kHz

8.5

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

4.0x10¹⁵ Ohms⋅cm

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore 00)	5

Thermal Properties

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

8.0 W/m.K

Thermal Impedance

0.19 °C·cm²/W

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Additional Information

Thermal putty pad VS. thermal gap pad

Thermal putty pads and thermal gap pad are similar products. For example, TGP8000 and TGP8000PT both have high thermal conductivity as 8 W/m.K and need at least 10% compression while applying. The main difference is that thermal putty pads are ultra-soft and could be compressed up to 90%. It almost has no tensile strength and no elasticity, thus will not recover and bounce back. Due to the low stress and high compressibility, thermal putty pads are more suitable for applications with large dimensional variances, comparing with traditional thermal gap pad.

Thermal putty pad VS. thermal hybrid gel

Both thermal putty pad and thermal hybrid gel belongs to gap filler type TIM, which are applicable for large bone line thickness application (>0.5mm). Thermal gel products are designed for automation process such as dispensing. Compared with hybrid gels, putty pads are suitable for large area assembly. It is easy to apply thermal putty pads manually and there is no needs for dispensing equipment.