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- LINQBOND PM-1221 | Two part polyurethane potting material
LINQBOND PM-1221 | Two part polyurethane potting material
- Low-stress potting material
- Excellent seismic and voltage resistance
- Room temperature curing
Product Description
LINQBOND PM-1221 is a two-component polyurethane potting material engineered for low-stress applications. It offers good insulating properties and exceptional high-temperature, seismic, and voltage resistance. With its excellent fluidity during application and minimal bubble formation upon curing, LINQBOND PM-1221 seamlessly integrates into your projects, ensuring a smooth and reliable finish.
LINQBOND PM-1221 is the ideal choice for casting bonding, and sealing electronic components operating in challenging environments such as high pressure, high frequency, humidity, and heat. It is perfectly suited for precision arresters, various transformers, filters, control boards, and igniters. LINQBOND PM-1221 viscosity can be customized according to customer requirements. PM-1221 is available in a clear transparent version. Other available colors can be found in the selector guide below.
Available Versions
LINQBOND PM-1221: Precision Bonding with Low-Stress Protection (STD)
LINQBOND PM-1221 Type E: High-Hardness Epoxy Replacement
LINQBOND PM-1221 Type M: Multi-Function Environmental Sealant
LINQBOND PM-1221 Type S: Flexible, Repairable Silicone Alternative
LINQBOND PM-1221 Type F Adhesive: Precision Bonding for Electronic Components
Technical Specifications
| General Properties | |||||||
| Chemistry Type | Polyurethane | ||||||
| Mix Ratio Mix Ratio The amount of a constituent divided by the total amount of all other constituents in a mixture | 5:1 | ||||||
| Pot Life Pot Life Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure. | 0.75 hours | ||||||
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.5–1.7 | ||||||
| Chemical Properties | |||||||
| Moisture absorption | 0.2 % | ||||||
| Electrical Properties | |||||||
| Dielectric Strength Dielectric Strength Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow. | ≥25 kV/mm | ||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 1.0 × 10¹⁵ Ohms⋅cm | ||||||
| Mechanical Properties | |||||||
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| Thermal Properties | |||||||
| Operating Temperature | –60 to 150 °C | ||||||
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | ≥0.6 W/m.K | ||||||
| UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole | V-0 | ||||||
| Curing Conditions | |||||||
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Additional Information
LINQBOND PM-1221 Polyurethane Potting and Adhesive Solutions
Unmatched Protection, Durability, and Performance for Precision Electronics
Discover the PM 1221 series—a high-performance line of polyurethane potting and adhesive solutions tailored to meet the unique demands of sensitive electronic components, from precision capacitors to transformers, control boards, and more. Designed to outperform standard materials, each formulation in the PM 1221 range delivers specific features that address key performance needs, offering robust protection with specialized functionality.
LINQBOND PM-1221 Polyurethane Potting Sealant: Precision Bonding with Low-Stress Protection
This all-in-one potting sealant excels in low-stress, seismic-resistant applications, ensuring long-lasting integrity under electrical, mechanical, and environmental pressures. Specifically designed for arresters, transformers, filters, and control boards, it boasts excellent electrical insulation and resistance to vibration, delivering an ideal solution for components in high-performance environments.
Key Benefits
- Low-Stress, Seismic-Resistant: Reduces risk of component fatigue
- Superior Electrical Properties: Optimal for voltage-intensive applications
- Versatile Compatibility: Bonds with a wide range of electronic components
LINQBOND PM-1221 Type E: High-Hardness Epoxy Replacement
Engineered with high hardness and durability, PM 1221 Type E is the go-to choice for applications requiring a firm, resilient bond. Ideal for potting precision capacitors, this sealant provides a stable alternative to traditional epoxy with greater ease of handling. When used with vacuum deaeration and heating equipment, it cures to a dense, rigid form with minimal bubbles—perfect for reinforcing and safeguarding intricate components.
Key Benefits
- High Hardness: Perfect for high-stress environments
- Epoxy Alternative: A cleaner, versatile substitute
- Precision Protection: Formulated for high-performance capacitors
LINQBOND PM-1221 Type M: Multi-Function Environmental Sealant
Purpose-built for environmental durability, PM 1221 Type M ensures electronics remain insulated, waterproof, and shockproof, even in challenging conditions. It’s the ultimate choice for protecting devices from moisture, dust, and other environmental hazards, providing complete peace of mind in a single potting and sealing solution.
Key Benefits
- Comprehensive Protection: Moisture-proof, shockproof, and waterproof
- Environmental Resilience: Seals against air, moisture, and external elements
- Broad Application: Suitable for diverse electronic assemblies
LINQBOND PM-1221 Type S: Flexible, Repairable Silicone Alternative
With unmatched elasticity and toughness, PM 1221 Type S offers a repairable, highly flexible sealant ideal for applications requiring both durability and the option to make modifications. This type outperforms traditional silicone potting in electrical properties, offering enhanced flexibility without compromising performance.
Key Benefits
- Repairable Flexibility: Adaptable for evolving project needs
- High Elasticity and Toughness: Ensures long-term durability
- Silicone Replacement: Enhanced electrical performance with flexible rework options
LINQBOND PM-1221 Type F Adhesive: Precision Bonding for Electronic Components
Semi-flowing for easy application, PM 1221 Type F adhesive offers robust bonding and sealing for electronic components where precision matters most. It delivers a strong, lasting hold that withstands the demands of high-performance applications.
Key Benefits
- Semi-Flowing Application: Easy handling for precision bonding
- Reliable Adhesion: Ideal for secure bonding in sensitive electronics
- Optimized for Electronics: Designed specifically for electronic components
Experience the next level of electronic protection and performance with PM 1221’s tailored polyurethane solutions.
| Properties | PM-1221 | PM-1221 Type E | PM-1221 Type M | PM-1221 Type S | PM-1221 Type F |
|---|---|---|---|---|---|
| Part A Appearance | Transparent, White Gray, Black Liquid | ||||
| Part B Appearance | Light Yellow Liquid | ||||
| Part A Viscosity | 6,000-9,000 | 20,000 | |||
| Part B Viscosity | 300-400 | 400 | |||
| Mixed Viscosity | 3,000- 5,000 | 10,000-15,000 | |||
| Pot Life | 30-45 | ≤30 | 45-60 | 45-60 | ≤30 |
| Initial Curing Time | 5-7 | 3-5 | 8-10 | 8-10 | 3-5 |
| Full Cure Time | 36 | 24 | 48 | 48 | 24 |
| Shore Hardness | 70-90 Shore A | ≥80 Shore D | 50-70 Shore A | 30-50 Shore A | ≥80 Shore D |
| Shear Strenght | ≥2.3 | ≥3.5 | ≥1.5 | ≥0.8 | ≥4.8 |
| Specific Gravity | 1.5 -1.7 | ||||
| Linear Shrinkage Rate | 0.3 | ||||
| Working Temperature Range | -60 up to 150 | ||||
| Dielectric Strenght | ≥25 | ||||
| Volume Resistance | 1.0E15 | ||||
| Thermal Conductivity | ≥0.6 | ||||
Processing Instructions
- Mix component A and B according to specified ratio. Stir thoroughly to ensure uniformity while preventing air to be introduced into the mixture.
- Degas the mixture to remove the bubbles for about 5 minutes. Do not fill the container more than half full to prevent overflowing during degassing.
- Gradually pour the mixed compound into the device being potted. If the ambient temperature is around 5 °C, preheat components A and B to around 15 °C.
- Allow the potted workpiece cure at room temperature until the surface is dry. Full curing typically occurs within 24 hours. The curing process is influenced by temperature variations; generally, higher temperatures result in faster curing, while lower temperatures lead to slower curing.
Precautions for Use
- Use the mixture promptly after combining components A and B to prevent a significant increase in viscosity.
- If the components have been stored for an extended period and exhibit precipitation or stratification, they should be thoroughly mixed before use. Component B is prone to crystallization at low temperatures; therefore, it should be stored in a warmer environment to melt prior to use, ensuring product performance remains unaffected.
Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.
Storage and Handling
Store in a ventilated, dry, and clean environment below 25 °C and 50% RH. Keep away from fire and heat sources. It is strictly forbidden to store in outdoor environments. At proper storage conditions, Part A and Part B has a shelf life of 6 months. Shelf life can be extended by using cold storage.