Humidity and temperature sensors range from common, consumer good devices that can be applied to a huge variety of industries and supply chains to industrial equipment with . They (obviously) measure the temperature and humidity of spaces, packages and shipments and their main difference is the accuracy, tolerance and operating conditions. Different sensors require different setups and BOMs and we can help you with packaging all of them. From the cheapest commodity sensor to the one that should withstand cryogenic or other extreme conditions.

High reliability sensors require molding compounds with good adhesion and reduced moisture uptake in order to increase their MSL performance. Catalytic to this point is the high filler loading that enables a lower moisture uptake.

Low warpage can be achieved by the usage of multifunctional resin hardener system with high Tg & high cross-linking degrees and with high filler loading for low CTE to minimize thermal mismatch. Finally, high performance stress modifiers can reduce internal stress.

 

GR9810-1P has been successfully applied in our customers’ sensor products. Embedded in a reflow solderable dual-flat no-leads (DFN) package of 3 × 3 × 1.1 mm3, the sensor contains a capacitive-type humidity sensor and a band-gap temperature sensor. It makes for a reliable and cost effective humidity sensor that controls a variety of applications such as consumer goods, automotive and HVAC applications.

 

Property / Product	Unit	Hysol GR9810-1P	Hysol GR9810-1PF
UNCURED PROPERTIES
Hot Plate Gel time,  @ 175°C	s	32	40
Spiral Flow @ 175°C	in	60	67
Flammability		V-0	V-0
Halogen-free (Green)		✔	✔
Shelf Life @ 5°C	months	12	12
TYPICAL CURED PROPERTIES
Specific Gravity, g/cc	g/cc	1.95	1.95
Glass Transition Temperature	°C	170	184
Coefficient of Thermal Expansion (CTE)     Alpha1     Alpha2	ppm/C ppm/C	11 50	11 40
Flexural Strength, @25°C	MPa	137	119
Flexural Strength, @240°C	MPa	19.6	19.6
Flexural Modulus (E), @25°C	GPa	20.6	20.6
Flexural Modulus (E), @220°C	GPa	2.26	2.26
Moisture Absorption, 24hr PCT	%	0.27	-
Mold Shrinkage, as molded	%	0.10	0.15
Thermal Conductivity	W/mK	0.9	-
Summary		Green Product High Tg and low shrinkage Long spiral flow and advanced warpage control Excellent dimensional stability  Excellent room temperature working life