LINQBOND UF3802 is a one-component epoxy adhesive developed for electronic device bonding. It is easy to operate and suitable for various applications, such as casting, sealing, and encapsulation of electronic components. This product cures quickly at high temperatures, reducing working time and increasing efficiency.
LINQBOND UF3802 forms tough, strong structural bonds that provide excellent shear, peel, and impact strength. The product's durability is exceptional, capable of passing numerous environmental tests. For under-filling CSP and BGA, it helps buffer the dilational shrinkage stress of tin balls and mitigates shear stress caused by counteracting forces during drop tests.
