Permasil 909C | Carnauba Wax Mold Release Spray

Harmonization Code : 3404.90.00.00 |   Artificial waxes and prepared waxes : Other
Main features
  • Carnauba wax Mold Release Spray
  • Solvent-based, non-flammable
  • Compatible with Epoxy Mold Compound

Product Description

PRODUCT UPDATE! MJGordon #909C is no longer supplied.
MJGordon have stopped supplying Permasil #909C. Fortunately, CAPLINQ has an alternative product: Chemlinq MRE-C909

GORDON'S PERMASIL #909C (Green Label) Non-Flammable Solvent-Based (Green Label), 100% Non-Ozone Depleting 539gr Can Carnauba Wax Aerosol Spray, Industrial, and Automotive Applications. By far the most popular grade with more than 90% of this grade in use, this version uses a non-flammable solvent to suspend the carnauba particles making an easy choice for manufacturers.

CAPLINQ Europe BV is the exclusive distributor for MJ Gordon #909C in Europe

Product Family
MJ Gordon Permasil 909C  
539gr Can 12-Can Case

No longer available

This product is no longer available or will become obsolete soon. Please contact us so we can recommend an alternative product.
Packaging
TDS, SDS & Technical documents

Technical Specifications

Additional Information

Additional information

Carnauba Wax Aerosol Spray will set your products free

GORDON'S PERMASIL #909C (Green Label) Non-Flammable Solvent-Based (Green Label), 100% Non-Ozone Depleting 539gr Can Carnauba Wax Aerosol Spray, Industrial, and Automotive Applications. By far the most popular grade with more than 90% of this grade in use, this version uses a non-flammable solvent to suspend the carnauba particles making an easy choice for manufacturers.

CAPLINQ Europe BV is the exclusive distributor for MJ Gordon #909C in Europe

Carnauba wax itself is nothing new. Carnauba is a natural wax derived from the carnauba palm, a palm tree native to the northeastern Brazil. It is used in a wide variety of applications including automotive waxes, shoe polishes, dental floss coatings, and paper coatings, the last of which is its most common application in the United States.

What makes this product so attractive is that it contains no silicone or Teflon® (DuPont trademark for the generic polytetrafluoroethylene or PTFE). While these ingredients may be well-suited for the release of rubber molds or to coat anti-stick surfaces, they rarely have a place when working liquid epoxy, epoxy molding compounds (EMC) and some other plastic types. CarnaubaWaxAerosolSprayMost semiconductor manufacturers know this of course, and use chunks of carnauba wax to break in new epoxy molds or to release the plunger when it sticks. Carnauba wax is compatible with epoxies and generally enhances its properties along with those of most other engineering plastics.

M.J. Gordon's Carnauba Wax Mold Release is dubbed as the "World's Finest Carnauba Wax Mold Release". What is unique about M.J Gordon's Carnauba Wax Release is the patented process of making it available in aerosol spray form. Typically, carnauba wax is only available in flakes, powder or clumps. These clumps are the same ones typically used by semiconductor manufacturers. What M.J. Gordon's aerosol spray version allows is uniformity, control, and the convenience of an aerosol spray.

"Unconditional Guarantee that every can will operate from its first spray until completely emptied without fail or the entire case of 12 cans will be replaced at no product nor freight cost to the customer."

Used worldwide by the leading manufacturers of semiconductors, capacitors, resistors, transformers, inductors, relays, electro-medical equipment and more, M.J. Gordon Mold Release Aerosol Formulas ensure that regardless of the product manufactured or the type of molding process performed, these quality products improve these operations. Not only do they offer the uniformity, control, and convenience of an aerosol spray, they actually enhance the Tensile Strength and Displacement Properties of highly engineered plastic resins as tested by an ISO9002 Certified Laboratory. Results of the tests are available upon request.

Many customers who have used other sprays in the past, whether it be Teflon® or silicone are amazed by the results they obtain after testing the carnauba wax aerosols. Semiconductor manufacturers in particular use this product regularly to break in new molds and after multiple shots of the epoxy mold compound. The carnauba wax prevents the epoxy mold compound from sticking in the mold-chase, rust-proofs the mold-chase and allows for easy release of the product from the chase once molded.

Current Commercial Applications:

  • Epoxy Molding Compound Mold Release for Active Semiconductors (ICs, TQFPs, BGAs, etc.)
  • Epoxy Molding Compound Mold Release for Passive Semiconductors (resistors, capacitors)
  • Mold Release Agent for transformers, inductors, relays, and electro-medical applications
  • New Mold Break-In
  • Incomparable Part Release Characteristics
  • Outstanding Rust Proofing Characteristics

Product Range of Carnauba Wax Aerosol Spray

There are only three versions of the solvent-suspended carnauba wax aerosol spray and by a long margin, the "Non-Flammable Green-Label" product is the most popular. This is due to its non-flammable solvent which makes it easier to ship internationally and makes is easier for customers to accept.

For all M.J. Gordon's products however, the above mentioned unconditional guarantee applies.

 

Permasil #909C: Non-Flammable, Solvent-Based (Green Label)

Permasil #909C carnauba wax aerosol spray

Permasil #909C: 539gr Can Carnauba Wax Aerosol Spray

By far the most popular grade with more than 80% of this grade in use, this version uses a non-flammable solvent to suspend the carnauba particles making an easy choice for manufacturers.

Permasil #808: Non-Flammable, Water-Based (Blue Label)

Permasil #808 carnauba wax aerosol spray

Permasil #808: 425gr Can Carnauba Wax Aerosol Spray

Taking up the majority of second place's demand, this grade is for use in applications where a water-based version must be used.

Permasil#909D: Flammable, Solvent-Based (Red Label)

Permasil #909D carnauba wax aerosol spray

Permasil#909D: 369gr Can Carnauba Wax Aerosol Spray

With far less than 5% of market share, this product is only ever used when manufacturers' specifications require it. Otherwise, this product has been entirely superseded by the other two grades.

 

Alternatives

 

Having a hard time getting MJGordon#909C?

CAPLINQ has spent several years developing an alternative to the industry standard MJ Gordon#909C. This alternative is still a Carnauba Wax based mold release agent but uses ingredients that take it off the SVHC list and can therefore be used as an excellent alternative for the MJ Gordon #909C.

Material Compatibility

Material Compatibility Chart (Measured as % of Material Properties Retained)
Material
#909 "C"
SOLVENT BASED
NON-FLAMMABLE
(Green Label)
#808 "Aqueous"
WATER BASED
NON-FLAMMABLE
(Blue Label)
#909 "D"
SOLVENT BASED
FLAMMABLE
(Red Label)
Tensile Strength
Maximum Displacement
Tensile Strength
Maximum Displacement
Tensile Strength
Maximum Displacement
ABS
A
A
A
A
A
A
Acetal
A
A
A
A
A
A
Acrylic
B
C
A
C
C
C
Epoxy
A
A
A
A
A
A
PEI
A
B
A
B
A
B
PET
A
A
A
A
A
A
Polycarbonate
A
C
C
C
A
C
Polethylene
A
B
A
A
B
A
Polypropylene
A
C
A
C
A
C
PPO
A
C
A
C
B
C
PPS
A
A
A
A
A
A
SBR Rubber
A
C
A
C
A
B
*A - Material Property Retention of 90-100+% .......................Highly Compatible
*B - Material Property Retention of 80-89+% ........................Moderately Compatible
*C - Material Property Retention of Less than 80% ................Not Compatible
1. The products herein are for industrial use only; suggestions for use are made without warranty expressed or implied
2. These data are intended as a guide; specific applicability must be ascertained through product testing within particular manufacturing conditions and parameters.
3. Prior to use ALL LABEL WARNINGS as well as those within the Material Safety Data Sheet (MSDS.) must be read and understood.
4. The testing was completed at an independent ISO 9002 certified laboratory.
5. Additional Test Data as well as methodology available upon request.

Troubleshooting

Guidelines for Troubleshooting Common Issues
Defect Description Try the following
Blistering, heavy section
  • lncrease cure.
  • Close mold slowly on low pressure, then apply high pressure to purge gas.
  • Vent mold.
  • Preheat to eliminate moisture. lncrease preform temperature.
  • Breathe mold as soon as possible.
  • Increase pressure.
  • Use stiffer material.
  • Lower mold temperature.
  • Check mold temperature for uniformity.
  • Vent mold at dead ends with vent pins.
Thick Flash
  • Reduce mold charge.
  • Reduce mold temperature.
  • lncrease high pressure.
  • Close on low, apply high pressure sooner.
  • Eliminate breathing, follow (4).
  • Use softer grade material for more pressure.
  • Be sure of 0.002-in. between force and cavity.
  • Be sure overfiow grooves are clean.
  • Reduce transfer pressure andlor increase clamping pressure.
Porosity (not filled out in every section)
  • Try a range of plasticities for best grade.
  • lncrease pressure.
  • Lower temperature.
  • Close mold faster if external porosity, apply high pressure sooner; close mold slower if internal porosity, apply low pressure longer
  • Preheat material.
  • Adjust charge weight.
  • Try a higher density material to obtain greater "hack pressure" in the mold.
  • Breathe mold earlier.
  • Use semi-positive molds to minimize porosity.
Mold sticking
  • Raise mold temperature.
  • Preheat to eliminate moisture.
  • Clean mold.
  • Use stiffer material.
  • Remove dents and undercuts in mold cavity and force.
  • Polish mold.
  • lncrease cure.
  • Lower pressure, softer material if plunger molding.
  • Check knockout pin adjustment.
  • Be sure cavities have sufficient drait.
Dull surface
  • Adjust mold temperature - usually reduce temperature for better appearance.
  • Polish mold.
  • Chrome plate.
  • Close mold more slowly.
Orange peel (rough, pimply surface)
  • Close slowly on low pressure. Delay 2 sec. before applying high pressure.
  • Preheat (radio frequency).
  • Use stiffer material.
  • Use finer ground material.
  • Use large preforms and as few as ~ossible.
  • use lower mold temperature.
Pitted surface
  • Use stiffer material.
  • Preheat.
Clouded or segregated surface.
  • Reduce molding temperature; for colors, 300 to 310°F (150° to 155°C)
  • Preheat preforms.
  • Adjust plasticity.
  • Adjust pressure and closing speed
Dimpled surface
  • Close slowly, longer on low pressure, no breathe, then high pressure.
  • Use stiffer material.
  • Lower mold temperature.
  • lncrease charge weight.
  • Shape preforms more closely to piece.
  • lncrease pressure.
Warped piece
  • Heat mold more uniformly.
  • Use stiffer material.
  • Preheat if soft plasticity.
  • lncrease cure.
  • Use lower shrinkage material. and/or material more rigid at discharge.
  • Redesign mold; use wider knockout pins.
  • Adjust temperature of force arid cavity - lower temperature may reduce warpage.
  • Preheat for irregular shaped pieces.
  • Cool uniformly and use shrink fixtures.
Cracking after molding
  • lncrease wall thickness around inserts.
  • Check knockout pins.
  • Correct size of shrink fixture.
  • Use more flexible material.
  • lncrease radii and ribs.
  • Oven anneal 2 hr. at 200°F.
Poor electrical properties
  • Close slowly.
  • Preheat 1.5 hrs. at 185°F.
  • Increase cure.
  • Reduce temperature.
  • Use stiffer grade.
Weak Mechanically
  • Increase temperature.
  • Increase cure.
  • Increase pressure.
  • High frequency preheat.
  • Increase charge.
  • Afterbake to increase strength, if economical. Try 2 hr. at 250°F (120°C)
Pimpling
  • Breathe mold.
  • Use higher fines material.
  • Use softer material.
  • R.F. preheat.
  • Lower mold temperature,
Burn Marks
  • Reduce preheat temperature.
  • Reduce mold temperature.
  • Open gates; be sure vents are * clear; check plunger travel time to see if it is between 5 and 12 sec. (faster close will entrap gas; slower close causes burn marks).
  • Avoid or minimize breathing.