Caplinq
  • Products
    Adhesives & Sealants
    • Adhesives & Sealants  Overview
    • Adhesives
    • Flat Gaskets
    • Sealants, CIPG & FIPG
    Coatings, powders & Resins
    • Coatings, powders & Resins  Overview
    • Epoxy Binding Resins
    • Epoxy Coating Powders
    • Conformal Coatings
    Die Attach Materials
    • Die Attach Materials  Overview
    • Die Attach Films
    • Die Attach Pastes
    • Sintering and Semi Sintering Pastes
    • Wafer Backside Coatings
    Electrochemical Materials
    • Electrochemical Materials  Overview
    • Carbon cloths & Fabrics
    • Conductive Plastic Films
    • Fiber Felts
    • Graphitized Carbon Papers
    • Ion Exchange Membranes & Polymers
    • Wire Meshes
    Electronics Assembly Adhesives & Inks
    • Electronics Assembly Adhesives & Inks  Overview
    • Assembly Film Adhesives
    • Electrically Conductive Adhesives
    • Non Conductive Adhesives
    • Printable Electronics Inks
    Encapsulants & Underfills
    • Encapsulants & Underfills  Overview
    • Low pressure molding
    • Potting materials
    • Liquid Encapsulants
    • Underfills
    • Optically Clear Materials
    • Wafer Level Packaging
    Fine & Specialty Chemicals
    • Fine & Specialty Chemicals  Overview
    • Additives
    • High Purity Alumina
    • Bismaleimides (BMI)
    • High Purity Silica
    • Reactive Silicones
    Molding Compounds
    • Molding Compounds  Overview
    • Industrial Epoxy Mold Compounds
    • Semiconductor Epoxy Mold Compounds
    • Optoelectronic Epoxy Mold Compounds
    Semiconductor Mold Maintenance
    • Semiconductor Mold Maintenance  Overview
    • Melamine Cleaning Compounds
    • Mold Release Sprays
    • Rubber Cleaning Sheets
    • Wax Conditioning Materials
    Soldering Materials
    • Soldering Materials  Overview
    • Bonding wires
    • Solder Elements
    • Solder Spheres
    • Tape and Reel
    • Solder Pastes
    Specialty Tapes & Films
    • Specialty Tapes & Films  Overview
    • Antistatic Tapes
    • Copper and Aluminum Tapes
    • Gas Detection Tapes
    • Glass Cloth Tapes
    • Nomex Films
    • Polyester Tapes
    • Polyimide Tapes and Films
    • PTFE Tapes
    Surface Treatments
    • Surface Treatments  Overview
    • Adhesion Primers & Promoters
    • 3M Novec replacements
    • Fluxophobic Stencil Treatments
    • PCB Waterproofing Treatments
    • Repellency Treatments
    Supply Chain Management
    • Supply Chain Management  Overview
    • Temperature Data Loggers
    • Insulated Packing boxes
    Thermal Interface Materials
    • Thermal Interface Materials  Overview
    • Phase Change Materials
    • Thermal Gap Pads
    • Thermal putty pads
    • Two Part Hybrid
    • One Part Hybrid
    • Thermal Grease
    • Thermal Insulators
    Other
    • Other  Overview
    • Leadframes
    • Heat Spreaders
    Learn more about CAPLINQ and the products and services we offer
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  • Applications
    SemiconductorsSemiconductors
    eMobilityeMobility
    Renewable EnergyRenewable Energy
    Electronics AssemblyElectronics Assembly
    Overview Advanced Packaging  
    • Chip on Board COB
    • Flip Chip CSP
    • Flip Chip BGA
    • Package On Package (PoP)
    • Memory
    Diodes  
    • Axial diodes
    • Schottky Diodes
    • Small Outline Diodes (SOD)
    Integrated Circuits  
    • Dual In Line (DIL)
    • Quad Flat No Lead (QFN/DFN)
    • Small Outline Package (SOP)
    • Intelligent Power Module
    Light Emitting Diodes  
    • IR Sensors
    • General Lighting
    • Emitters
    • Transceivers
    • Optocoupler
    Transistors  
    • Metal Oxide Semiconductor FETS
    • Insulated-Gate Bipolar Transistor (IGBT)
    • Small Outline Transistors (SOT)
    • Transistor Outline (TO)
    Thyristors  
    • Photothyristors
    • TRIAC
    • Reverse Conducting
    Reliability  
    • Preconditioning
    • Moisture Sensitivity Level
    • Common Reliability Tests
    Overview EV Batteries  
    • Battery (BMS) & Cell Controller
    • Battery packs
    EV Charging stations  
    • Charging Connector
    • Level 1
    • Level 2
    • Level 3
    EV Propulsion Systems  
    • IPM Motors
    • Magnet fixing
    • Hybrid Dual-Clutch Transmission
    Motor armatures  
    • Slot insulation
    Power Conversion Systems  
    • Inverters
    • DC/DC Converter
    • On board chargers
    Overview Batteries  
    • Redox Flow Batteries
    • Lithium Ion Batteries
    Busbars  
    • Low voltage
    • Medium Voltage
    Carbon Dioxide Electrolyzers  
    • Ion Exchange Membrane for CO₂ Electrolysis
    • Gas Diffusion Electrodes for CO₂ Electrolysis
    Fuel Cells  
    • Ion Exchange membranes
    • Gas Diffusion Layers
    • Electrodes
    Solar Energy  
    • Photovoltaics
    • Power systems
    Water Electrolyzers  
    • AEM Electrolyzers
    • Alkaline Electrolyzers
    • PEM Electrolyzers
    • Porous Transport Layers for Water Electrolyzers
    Overview Sensors  
    • Automotive Camera Module
    • CMOS Image Sensors
    • Fingerprint Sensors
    • Humidity and Temperature sensors
    • MEMS Sensors
    • Optical Sensors
    Smart Cards  
    • Wire Bonded
    • Flip Chip
    Substrates  
    • Printed Circuit Boards (PCBs)
    Passive components  
    • Capacitors
    • Inductors
  • Services

    Order Fulfillment

    • Order Fulfillment Service
    • Order Fulfillment Pricing
    • Cold Supply Chain
    • European Warehouse
    • Fiscal Representation Europe

    Technical Representation

    • Technical Representation Overview
    • European Sales Agent
    • European Sales Office
    • Testing Services

    Technical Marketing

    • Technical Marketing Overview
    • Consignment Sales Europe
    • Online Sales Platform
    • Online Chemicals Portal
    • Private Label Products

    REACH Services

    • REACH Services Overview
    • REACH Only Representative
    • REACH Safety Data Sheets
    • REACH Testing
    • REACH Consulting
    Learn more about CAPLINQ and the products and services we offer
      Learn more
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Advanced Packaging

Advanced Packaging

Flip Chip, Wafer level and 3D memories

CSP, BGA, PoP, Fan in, Fan out
Advanced Packaging Diodes Integrated Circuits Light Emitting Diodes Transistors Thyristors Reliability
  • Home
  • Semiconductors
  • Advanced Packaging

Advanced Packaging

 

Chip on Board COB

Chip on Board COB

Flip Chip CSP

Flip Chip CSP

Flip Chip BGA

Flip Chip BGA

Package On Package (PoP)

Package On Package (PoP)

Memory

Memory

Leading brands trust in our products and services
  • AMS
  • Apple
  • Audi
  • Broadcom
  • Borgwarner
  • Bosch
  • Eaton
  • Henkel
  • Honeywell
  • Hysol
  • Intel
  • Jabil
  • Linxens
  • Magna
  • Medtronic
  • NXP
  • Philips
  • Semikron
  • Teledyne
  • Thales
  • Vishay
  • ZF
Europe
Caplinq Europe BV
  • CAPLINQ Europe BV
  • Industrieweg 15E, 1566JN Assendelft
  • The Netherlands
  • Phone: +31 (20) 893 2224
Americas
Caplinq Americas
  • CAPLINQ Americas, Inc.
  • 36927 Schoolcraft Rd.
  • Livonia, MI 48150 - USA
  • Phone: +1 (618) 416 9739
Caplinq Corporation
  • CAPLINQ Corporation
  • 80 Sirocco Crescent
  • Ottawa ON, K2S 2C9 - Canada
  • Phone: +1 (613) 416-8426
Asia
Caplinq China
  • CAPLINQ China
  • Minle Garden, Baoan district
  • Shenzhen City - 51831 - China
  • Phone: +86 136 8608 1428
Caplinq Philippines
  • CAPLINQ Philippines, Inc.
  • Unit 611 & 612 Civic Prime Bldg.
  • 2501 Civic Drive, Filinvest City
  • Alabang, Muntinlupa
  • 1781 Metro Manila, Philippines
  • Phone: +63 (939) 919 2437
Caplinq Malaysia Sdn Bhd
  • CAPLINQ Malaysia Sdn Bhd
  • S-08-07, Persiaran Kelicap Setia Triangle
  • 11900 Bayan Lepas, Penang
  • Malaysia
  • Phone: +60 (15) 460 00453
Caplinq locations
  • CAPLINQ Corporation - Canada
  • 80 Sirocco Crescent
  • Ottawa ON, K2S 2C9 - Canada
  • Phone: +1 (613) 416-8426
  • CAPLINQ Americas, Inc - America
  • 36927 Schoolcraft Rd.
  • Livonia, MI 48150 - USA
  • Phone: +1 (618) 416 9739
  • CAPLINQ Europe BV - The Netherlands
  • Industrieweg 15E, 1566JN Assendelft
  • The Netherlands
  • Phone: +31 (20) 893 2224
  • CAPLINQ China
  • Minle Garden, Baoan district
  • Shenzhen City - 51831 - China
  • Phone: +86 135 0156 7069
  • CAPLINQ Philippines, Inc.
  • Unit 611 & 612 Civic Prime Bldg.
  • 2501 Civic Drive, Filinvest City
  • Alabang, Muntinlupa
  • Metro Manila, Philippines
  • Phone: +63 (939) 919 2437
  • CAPLINQ Malaysia Sdn Bhd
  • S-08-07, Persiaran Kelicap Setia traingle
  • 11900 Bayan lepas, Penang
  • Malaysia
  • Phone: +60 (15) 460 00453
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