BMI-2500 | Imide extended Bismaleimide powder

Harmonization Code : 2925.19.95.90 | Carboxyimide-function compounds (including saccharin and its salts) and imine-function compounds : Imides and their derivatives; salts thereof : Other : Other : Other

Main features

Hydrophobic
Toughener
Increased modulus and Tg

Product Description

BMI-2500 has been designed to extend the range of applications suitable for use with the Designer Molecules, Inc. imide extended bismaleimide oligomers to those in need of higher Tg and modulus. The material has excellent low pH hydrolytic resistance and thermal stability. As an additive it can improve rheological properties by increasing the thixotropic properties of a liquid monomer composition. This feature in turn can help to reduce resin bleed out on a variety of surfaces. It is soluble in most aromatic and aliphatic solvents such as toluene, xylene, NMP, etc. It can be processed in a resin system as a solid or dissolved in a solvent.

BMI-2500 is recommended for use as an additive to increase flexibility, hydrophobicity and thixotropy. When used as a base resin, it can produce films that are tough, flexible and demonstrate good peel strength. BMI-2500 is compatible with PPE and Acrylates for free radical reaction and epoxy with anionic cure.

Product Family
BMI-2500

1. Select Package Type

1Kg Jar

Price starting from $331.25

Shortest leadtime

No longer available

Shipping in 1 - 2 weeks

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Packaging

TDS, SDS & Technical documents

Specifications

Technical Specifications

General Properties

Appearance

Appearance
Appearance at room temperature.

Light Yellow

Functionality

Chemical Properties

Water Absorption

0.25 %

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	89 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	189 ppm/°C

Decomposition Temperature

438 °C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

140 °C