Sensors

MEMS, Cameras, Fingerprints

Humidity and temperature sensors

Automotive Camera Module CMOS Image Sensors Fingerprint Sensors Humidity and Temperature sensors MEMS Sensors Optical Sensors

Optical Sensors

Optical sensors are primarily separated into through hole, surface mount and map molded surface mount devices and are used for light sensing and data transmission.

Optoelectronic molding compound requirements.

Data transmission sensors need to operate on the 680nm wavelength range while light sensors should be able to operate either on the visible light spectrum (400-700nm) or on the infrared range (800-1500nm)

When it comes to package types, Through hole doesn't require MSL and the CTE is less important. Surface mount requires a certain MSL level while CTE is still not as important. And finally Map molded surface mount where both MSL needs to be attainable while CTE needs to be fine tuned to the substrate so that we avoid shrinkage and warpage.

Through Hole Package Type

Key Application Requirements

High transmittance in visible & IR Wavelengths
Low cost and miniature
MSL data is not critical

Key Material Requirements

Clear, high transmission, specifically @400nm-1500nm
High hot hardness to be removed properly from molds
High adhesion to metal leadframes (Ag, Ni, Pd, Au & Cu)

Surface mount Package Type

Key Application Requirements

High transmittance in Red & IR Wavelengths
Low cost and miniature
Trade-offs of transmission for higher MSL data is possible
Device MAY or MAY NOT be MAP-molded

Key Material Requirements

Clear, high transmission, specifically @400nm-1500nm
High hot hardness to be removed properly from molds
High adhesion to metal leadframes (Ag, Ni, Pd, Au & Cu)
Possibly filled for better MSL performance
If MAP molded, low CTE is required

For Through hole devices, there are some products that are "tried and true" and have proven their value in the industry. TC 8020T comes as a breakthrough product with better moldability, lower moisture absorption, better MSL level and heat resistance. On top of that, the adhesion to Cu is better than the main competitive choices.

	Units	XX324H-11000	XX18	CAPLINQ TC-8020T
Specific Gravity	g/cc	1.25	1.33	1.23
Spiral Flow @ 150°C	inches	82	37	78
Hot Plate Gel Time @ 160°C	seconds	30	45	30
Cure Conditions		4min@150°C + 3hrs@150°C	4min@150°C + 3hr@150°C	4min@150°C + 3hr@150°C
Hardness	Shore D	86	85	86
Mold Shrinkage	%	1.6	1.6	1.6
Tg by TMA	°C	130	125	125
CTE by TMA, Alpha1 CTE by TMA, Alpha2	ppm/°C	65 170	70 180	70 170
Moisture absorption 1 hr @ 95°C 24hrs @ 25°C	%	0.32 0.16	0.77 0.40	0.32 0.17
Flexural Strength @25°C Flexural Modulus @25°C	MPa Gpa	129 3.2	107 3.6	130 3.0
Refractive Index @633nm	-	1.57	1.52	1.56
Transmittance @460nm, initial	%	>90%	>90%	> 90%
after 10,000 hrs @ 125°C	%	83%	72%	86%
after 1,000 hrs @ 150°C		63%	27%	68%
MSL JEDEC Level Capable	-	MSL 4	MSL 4	MSL 3