HPA-4N-SMB | 3 - 4N Purity Alumina

Additional Information

Applications

Thermally Conductive Filler

HPA-4N-SMB is ideal for thermally conductive applications due to its spherical morphology and high purity. The thermal conductivity of HPA typically ranges from about 25 to 30 W/m-K  wherein in high-purity grades (99.99% or higher) generally have thermal conductivity closer to the upper end of this range.

Its spherical morphology enables higher packing density compared to irregularly shaped particles. This allows for a more uniform distribution within a matrix, reducing voids and increasing the thermal path flow of the composite material. Another advantage of its morphology is it reduces the composite mixture's viscosity compared to irregularly shaped particles. This improves the processability of the material, allowing for higher filler loading without significantly impacting the workability.

The material as a thermal conductive filler enables manufacturers to leverage the advantages to enhance the performance, processability, and durability of their resin matrices.

Technical Ceramics

HPA-4N-SMB is particularly well-suited for sintering processes used in the production of high-performance ceramics and components. Its spherical morphology and controlled particle size contribute to uniform packing density and low porosity in sintered products, leading to enhanced mechanical strength, thermal stability, and electrical insulation properties of the industrial ceramic.

One of the most significant applications of alumina in the ceramics industry is as a refractory material. Due to its high melting point, alumina is used as a lining material in high-temperature furnaces and kilns in applications where contaminants should be virtually non existent. Alumina also provides excellent thermal shock resistance, making it an ideal material for use in refractory applications. Alumina is also used as a grinding media in the ceramics industry. The hardness and wear resistance of alumina make it an ideal material for use in grinding applications. Alumina grinding media are used in ball mills, vibratory mills, and other types of grinding equipment.

Battery & LED Technologies 

HPA-4N-SMB is crucial in advanced battery technologies, especially for enhancing thermal management and safety in battery systems. One of its primary applications is in lithium-ion batteries (LiBs), where it serves as a coating for the battery separator, which lies between the cathode and anode. By coating the separator with HPA-4N-SMB, thermal shrinkage is significantly reduced, preventing potential short circuits that could compromise the battery’s safety. Additionally, the coating helps inhibit dendrite growth, which can adversely affect lithium-ion transport, further enhancing the battery's performance and longevity.

HPA-4N-SMB is also highly compatible with various coating processes. Its uniform particle size and spherical shape allow for easy dispersion into different matrices, forming stable suspensions essential for creating smooth, defect-free coatings. This makes it particularly advantageous for applications like LED phosphor coatings or protective layers in electronic devices, where surface consistency and uniformity are critical for optimal performance.

Note: Alumina coated battery separator prevent thermal shrinkage during high temperature operations. 
Reference: Research Study: Preparation of a high-purity ultrafine α-Al2O3 powder and characterization of an Al2O3-coated PE separator for lithium-ion batteries by Dong-Won Lee, Sang-Hun Lee, Yong-Nam Kim, and Jong-Min Oh

Industrial Processing Compatibility

Pressing and Forming of a Green Body part

Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) Coating Technique

Additive 3D Printing

Pressing and Forming

In pressing and forming applications, such as powder metallurgy or ceramic shaping, HPA-4N-SMB's consistent particle size and spherical shape allow for excellent flowability and compaction. This ensures uniform density and minimal defects in the green body, which are crucial for achieving high-quality finished parts. The material's low impurity levels further reduce the risk of contamination, making it suitable for high-precision components.

Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD)

For applications involving thin film deposition techniques such as Chemical Vapor Deposition (CVD) or Physical Vapor Deposition (PVD), HPA-4N-SMB's high purity and uniform particle size are critical. These characteristics ensure the production of films with consistent thickness, uniform coverage, and minimal defects, which are essential for producing high-quality, functional surfaces in semiconductor and optical applications.

Additive Manufacturing (3D Printing)

With the rise of additive manufacturing, HPA-4N-SMB has proven to be an excellent material for 3D printing high-performance ceramic components. Its fine, uniform particles and high surface area enable precise layer-by-layer deposition, resulting in parts with superior detail and complexity. The material’s thermal conductivity and stability also make it suitable for printing components that require excellent heat dissipation or insulation, such as in electronic devices or thermal management systems.

Customized Solutions

HPA-4N-SMB is produced using advanced manufacturing techniques that ensure high consistency and quality. Our state-of-the-art processing technology guarantees minimal contamination, making it a reliable choice for demanding applications. We offer customizable solutions to meet specific requirements, supported by expert technical assistance and collaborative R&D efforts.