HPA-M3 | 5N Purity Alumina

Main features

5N purity (99.999%)
2- 3um particle size
Ideal for Semiconductor manufacturing

Product Description

HPA-M3 is an alumina powder of the highest purity of 5N grade (99.999%) purity level. It has an irregular morphology and a surface area of 8-15 m²/g. This alumina material is customized to satisfy the rigorous requirements of semiconductor manufacturing, with unmatched performance in applications that demand high temperature and high purity. The D50 particle size is in the range of 2-3 µm, ensuring consistent performance across various processes.

Specifications
Additional Information

Technical Specifications

General Properties

Morphology

Irregular

Particle size (D50)

2 - 3 um

Purity

99.9999 %

Chemical Properties

Phase

Other Properties

Impurities
Calcium (Ca)	3 ppm
Iron (Fe) Iron (Fe) A chemical element with a melting point of 1,538 C	3 ppm
Silicon (Si)	4 ppm
Sodium (Na)	10 ppm

Additional Information

Purity	Key Element concentration (ppmw)
	Na	Si	Ca	Fe	Others
5N	<10	<4	<3	<3	<1

High Purity Alumina (HPA) in the Semiconductor Industry

The semiconductor industry demands materials of the highest quality and consistency, and High Purity Alumina (HPA) plays a critical role in ensuring the reliability and performance of cutting-edge technologies. With purity levels ranging from 4N (99.99%) to 5N (99.999%), HPA provides unparalleled advantages for semiconductor manufacturing processes and components.

Applications in the Semiconductor Industry

HPA can be used for a wide variety of applications, providing exceptional benefits. In the following table we tried to outline the applications the impact that HPA can have for Semiconductor related applications.

Etching Components and Process Equipment
HPA is essential in the production of etch tool components used in advanced semiconductor manufacturing. Its high purity minimizes trace metal contamination, reducing defect rates in intricate devices such as integrated circuits (ICs) and microprocessors.
Ceramic Substrates and Wafer Handling
HPA is a key material for ceramic components like electrostatic chucks and insulating layers used in wafer handling. Its excellent dielectric properties and thermal stability ensure superior performance in high-temperature and high-frequency environments.
Protective Coatings for Semiconductor Tools
Alumina coatings derived from HPA improve the wear resistance and longevity of critical tools and components in semiconductor fabrication. The high hardness and corrosion resistance of HPA-based ceramics protect against chemical and mechanical degradation.
CMP Slurries for Polishing
Chemical Mechanical Planarization (CMP), a crucial process in semiconductor wafer fabrication, uses HPA as a base material for slurries. Its uniform particle size and exceptional purity ensure smooth, defect-free polishing, which is critical for creating high-performance devices.
Sapphire Substrates for LEDs and Optoelectronics
HPA is used to grow sapphire crystals for substrates in light-emitting diodes (LEDs) and optoelectronic components, which are integral to modern semiconductor applications. Sapphire's superior optical clarity and thermal conductivity are made possible by ultra-high purity HPA.

Application	Description	Impact on the Semiconductor Industry
Etching Components	Used in etching tool parts	Minimizes defect rates due to high purity, crucial for ICs and microprocessors.
Ceramic Substrates	Electrostatic chucks, insulators	Offers thermal stability and dielectric strength for high-temperature environments.
Protective Coatings	Enhances tool longevity	Improves resistance to wear and corrosion, extending equipment life.
CMP Slurries	Base material for polishing	Provides smooth, defect-free wafer surfaces essential for high-performance chips.
Sapphire Substrates	For LEDs and optoelectronics	Ensures optical clarity and thermal conductivity for efficient LED production.

Benefits of HPA in Semiconductor Manufacturing

Reduced Contamination Risks
Improved Dielectric Performance
Thermal and Mechanical Stability
Eco-Friendly Production

Property	Benefit	Description
Purity Level	4N (99.99%) to 5N (99.999%)	Reduces contamination, increases yield, and ensures device reliability.
Dielectric Performance	Excellent insulation properties	Allows for better performance in high-frequency applications.
Thermal Stability	Maintains integrity under heat stress	Critical for maintaining operational consistency in semiconductor processes.
Environmental Impact	More sustainable production	Aligns with industry trends towards eco-friendly manufacturing processes.