Hysol GR2720 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol GR2720 | Black Epoxy Mold Compound

Main features

For conductive polymer and AO capacitors
Excellent thin wall crack resistance
Fast cure for automold equipment

Product Description

Hysol GR2720 is a low stress, black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of Conductive Polymer Capacitors and Aluminum Organic (AO) capacitors. Polymer conductive capacitors and Aluminum Organic capacitors offer very high capacitance in a very small size. Epoxy molding compounds designed for these packages must have very low stress and very good thin wall crack resistance. This is the only way to be able to pass the MSL performance on these package types. GR2720 excels in both fields and has both low stress and excellent thin wall crack resistance.

Hysol GR2720 is a laser markable, environmentally free, halogen free "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Aluminum Organic (AO) capacitors as well as conductive polymer capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2720 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

Product Family
GR2720

1. Select Product Form

Pellet

2. Available Pellet Size

14.3 mm

3. Available Pellet Weight

5 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

79 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.87

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -20°C	183 days
Shelf Life @ 5°C	365 days

Physical Properties

Spiral Flow @ 175°C

96.5 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	5 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	2 ppm

Moisture absorption

0.30 %

Electrical Properties

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
Conductivity	2 mmhos/cm

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

3.2x10¹⁷ Ohms⋅cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	16500 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	1650 N/mm2

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C	90

Molded Shrinkage

0.23 %

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	5.8

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	18 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	58 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	19 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

160 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.7 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F	70 - 90 s
Curing Time @ 175°C / 347°F (Automold)	50 - 70 s
Mold Temperature	140 - 180 °C
Preheat Temperature	80 - 95 °C