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- Hysol GR720 | Black Epoxy Mold Compound
Hysol GR720 | Black Epoxy Mold Compound
- High reliability
- Green and halogen-free
- Designed for SOT applications
Product Description
Hysol GR720 is a green, halogen-free epoxy molding compound specifically developed for SOT (Small Outline Transistor) packages with stringent requirements. GR720 sets new standards for performance and reliability in the electronics manufacturing realm. With a strong focus on die attach paste bonded SOT, GR720 excels in minimizing stress during bonding, ensuring the longevity of sensitive semiconductor components. Its low-stress formulation is a vital attribute, enhancing the durability of electronic devices.
Hysol GR720 its exceptional resistance to delamination, even after exposure to the rigorous conditions of MSL1 (Moisture Sensitivity Level 1) and TC1000 (Thermal Cycling at 1000 cycles). This outstanding performance guarantees the reliability of your devices, even when subjected to harsh environmental conditions. Moreover, Hysol GR720 offers exceptional workability, streamlining manufacturing operations and boosting overall efficiency.
Previously, packages molded with Hysol GR720 was able to achieve a Moisture Sensitivity Level (MSL) rating of 3 for die attach paste bonding. Additionally, it boasts remarkable filler properties with a filler content and cut of 84±1% and 75 µm, providing the best possible moldability and as wide a molding latitude as possible. HYSOL GR720 also meets UL94 V-0 Flammability at 1/8 inch thickness.
Technical Specifications
| General Properties | |||||||||
| Color Color The color | Black | ||||||||
| Filler Content | 84 % | ||||||||
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.92 | ||||||||
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| Physical Properties | |||||||||
| Spiral Flow @ 175°C | 119.38 cm | ||||||||
| Chemical Properties | |||||||||
| Moisture absorption | 0.40 % | ||||||||
| Mechanical Properties | |||||||||
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| Electrical Properties | |||||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 26×10¹⁵ Ohms⋅cm | ||||||||
| Thermal Properties | |||||||||
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| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 113 °C | ||||||||
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 0.92 W/m.K | ||||||||
| UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole | V-0 | ||||||||
| Curing Conditions | |||||||||
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| Transfer Pressure | 40–85 kg/cm2 | ||||||||
| Transfer Time | 7–15 s | ||||||||
Additional Information
Adhesion Strenght Data
| Property | Value | Unit |
| Adhesion at RT to Cu Substrate after PMC | 7.22 | MPa |
| Adhesion at RT to Cu Substrate after Preconditioning | 6.82 | MPa |
Storage
Keep the product in its sealed container within a dry environment. Material that has been taken out of its containers can become contaminated while in use. Please refrain from putting the product back into the original container.
Optimal Storage: 5 °C. Storage greater than 5°C can adversely affect product properties.