Hysol GR910-K | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Hysol GR910-K | Black Epoxy Mold Compound

Main features

Halogen free
High fluidity to avoid W/S issue
Designed for BGA/LGA

Product Description

Hysol GR910 K is a black epoxy molding compound specifically designed for Memory Ball Grid Arrays (BGA) and Land Grid Arrays (LGA). This semiconductor-grade material features spherical silica filler with a cut size of 53 µm, delivering exceptional fluidity and low shrinkage, which aids in advanced warpage control during manufacturing.

Hysol GR910 K is halogen-free and environmentally friendly, ensuring compliance with stringent safety standards. It offers excellent electrical performance, meeting the UL 94 V-0 flammability standard at a thickness of 1/8 inch.

Available Versions:

GR910 K-16 | Optimized for high Tg and low modulus applications
GR910 K-31 | Tailored for high Tg and low shrinkage requirements

Key Features:

High Thermal Stability | Glass transition temperatures of 155°C (GR910 K-16) and 153°C (GR910 K-31)
Excellent Flowability | Ensures uniform coverage and filling during the molding process
Low Mold Shrinkage | 0.22% for GR910 K-16 and 0.19% for GR910 K-31, contributing to precise dimensions
Low Coefficient of Thermal Expansion (CTE) | Minimizing stress during thermal cycling
Low Water Absorption | Less than 0.35%, enhancing reliability in humid environments

Highly Recommended For:

Advanced semiconductor packaging in high-performance applications
Memory devices requiring robust mechanical and thermal properties
Environmentally conscious projects where halogen-free materials are a must

Product Family
GR910K

1. Select Product Form

Pellet

2. Available Pellet Size

14 mm

3. Available Pellet Weight

4.4 gr

4. Available Package Size

15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

89 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.01

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Physical Properties

Spiral Flow @ 175°C

172 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	10 ppm

Moisture absorption

0.33 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	24.5 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	145 N/mm2

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	6.0

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	9 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	32 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	49 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

152 °C

Additional Information

GR910-K Series Product Properties Comparison

PROPERTY	UNIT	GR910 K-16	GR910 K-31
Filler Content	%	86.5	89
Filler Cut	um	53	53
Filler Shape	-	Spherical	Spherical
Specific Gravity	-	1.97	2.01
Spiral Flow	cm	200	172
Hot Plate Gel Time	sec	43	49
Glass Transition Temperature	°C	155	153
CTE by TMA, α1 CTE by TMA, α2	ppm ppm	10 37	9 32
Water Absorption (PCT24h)	wt%	0.35	0.33
Flexural Strength @25°C Flexural Modulus @25°C	MPa Gpa	141 19.8	145 24.5
Mold Shrinkage (After PMC)	%	0.22	0.19
Cl-	ppm	7	10
pH	-	6.1	6.0
MSL Capability	-	MSL 2	MSL 3
Feature		High Tg Good Flowability Low Modulus	High Tg Low Shrinkage Low CTE