Hysol GR920 | Epoxy mold underfill

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Molding underfill
  • Excellent narrow gap fill
  • Outstanding warpage control

Product Description

Hysol GR920 is a molding underfill product series. This product is not formulated with low-alpha silica but we could develop a low alpha version, suitable for memory chips, if needed.
 
Hysol GR920 is based on a MAR/LMW chemistry with an MF/MAR hardener and an MH flame retardant. Molding underfills are typically used for BGA, flip chip applications.
 
 
 
Features
  • Good reliability performance on advanced packaging
  • Excellent narrow space filling.
  • Meet MSL3~MSL2/260C requirement.
  • Outstanding warpage control(unit warpage<80 μm ).
  • Meet UL94 V-0 flammability rate at 1/8 inch thickness.
Product Family
GR920  
Pellet
14 mm
4.4 gr
10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Density (g) 2 g/cm3
Filler Content 88,5 %
Physical Properties
Spiral Flow @ 175°C 102 cm
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C 79
Molded Shrinkage 0,17 %
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 9 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 35 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 40 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 120 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 0.9 W/m.K

Additional Information

GR920 Series Products Properties Comparison

Property / Product Unit  Hysol GR920 H4 Hysol GR920 Q2 Hysol GR910 M12 Hysol GR910 L20 Hysol GR920 A1
UNCURED PROPERTIES
Epoxy Type   MAR MAR/MF MAR/BP MAR/MF BP
Hardener Type   MAR MAR/MF MAR MAR/MF PN/MF
Filler cut µm 20 20 20 20 20
Filler content % 84 85 88.5 88 87.5
Filler Type   Spherical Spherical Spherical Spherical Spherical
Hot Plate Gel time, @ 175°C s 34 39 37 34 46
Spiral Flow @ 175°C cm 152 142 99 91 167
Halogen-free (Green)   ✔ ✔ ✔ ✔ ✔
TYPICAL CURED PROPERTIES
Glass Transition Temperature, TMA °C 102 138 120 158 150
Glass Transition Temperature, DMA °C 113 146 127 156 151
Coefficient of Thermal Expansion (CTE) α1, TMA ppm/°C 14 12 10 9 9
Coefficient of Thermal Expansion (CTE) α2, TMA ppm/°C 43 45 35 33 34
Flexural Strength @25°C MPa 125 146 120 154 138
Flexural Modulus @25°C MPa 13500 15500 19500 17800 24000
 Storage Modulus by DMA @25°C Mpa 21000 20700 24000 25914 24000
 Storage Modulus by DMA @175°C Mpa 350 1200 950 2119 2000
 Storage Modulus by DMA @260°C Mpa 235 650 650 1203 1100
Water Absorption, 24hr PCT % - - - 0.37 0.38
Mold Shrinkage after PMC % 0.36 0.26 0.13 0.20 0.19
Hardness Shore D 76 77 76 81 80

 

Beta Site Performance in HT**

Property / Product Unit  Commercial Hysol GR910 L20
UNCURED PROPERTIES
Epoxy Type   - MAR/MF
Hardener Type   - MAR/MF
Filler cut µm 20 20
Filler content % 88 88
Hot Plate Gel time, @ 175°C s 30 34
Spiral Flow @ 175°C cm 99 91
TYPICAL CURED PROPERTIES
Glass Transition Temperature, TMA °C 142 158
Glass Transition Temperature, DMA °C 150 156
Coefficient of Thermal Expansion (CTE) α1, TMA ppm/°C 9 9
Coefficient of Thermal Expansion (CTE) α2, TMA ppm/°C 37 33
Flexural Strength @25°C MPa 175 154
Flexural Modulus @25°C MPa 19500 17800
 Storage Modulus by DMA @25°C Mpa 25000 25914
 Storage Modulus by DMA @175°C Mpa 3000 2119
 Storage Modulus by DMA @260°C Mpa 1200 1203
Water Absorption, 24hr PCT % 0.38 0.37
Mold Shrinkage after PMC % 0.18 0.20
Hardness Shore D 83 81

 

Package Mold Cap Strip Size Package Size Die Size Bump Height
FCCSP 0.4 mm 240.5 * 95 * 0.22 mm 5.4 * 5.4 mm 3.3 * 2.8 * 0.15 mm 65 µm
 
Item Hysol GR910 L20
Appearance
C-Scan
T-Scan
Bump-Scan
Warpage

Short Side 2.07 mm

Long Side 2.11 mm
Marking OK
Test Item Qualification Test Condition Test Results Test Criterion SAT
Before Test / Pass NA
Pre-conditioning


Baking: 125°C, 24 hours

Moisture Soak: 30°C/60%RH, 192 hours

Reflow @ 260°C * 3times

 Pass J-STD-020E
uHAST

130°C, 85%RH

33.3 psia, unbiased 192 hours

 Pass JESD22-A118B
TCB -55°C~125°C, 1000 cycles Pass JESD22-A104E

 

Beta Site Performance in JT**

Property / Product Unit  Commercial Hysol GR910 L20
UNCURED PROPERTIES
Epoxy Type   - MAR/MF
Hardener Type   - MAR/MF
Filler cut µm 20 20
Filler content % 88 88
Hot Plate Gel time, @ 175°C s 30 34
Spiral Flow @ 175°C cm 99 91
TYPICAL CURED PROPERTIES
Glass Transition Temperature, TMA °C 142 158
Glass Transition Temperature, DMA °C 150 156
Coefficient of Thermal Expansion (CTE) α1, TMA ppm/°C 9 9
Coefficient of Thermal Expansion (CTE) α2, TMA ppm/°C 37 33
Flexural Strength @25°C MPa 175 154
Flexural Modulus @25°C MPa 19500 17800
 Storage Modulus by DMA @25°C Mpa 25000 25914
 Storage Modulus by DMA @175°C Mpa 3000 2119
 Storage Modulus by DMA @260°C Mpa 1200 1203
Water Absorption, 24hr PCT % 0.38 0.37
Mold Shrinkage after PMC % 0.18 0.20
Hardness Shore D 83 81

 

 

Package Mold Cap Strip Size Package Size Die Size Bump Height
FCCSP 0.365mm 240 * 95 * 0.18 mm 6.3 * 6.9 mm 6.35 *5.57 *0.15 mm 80 µm
 
Item Hysol GR910 L20
Appearance
C-Scan
T-Scan
Strip Warpage

2~3 mm
Marking OK
Test Item Qualification Test Condition Test Results Test Criterion
Before Test / Pass NA
Pre-conditioning


Baking: 125°C, 24 hours

Moisture Soak: 30°C/60%RH, 192 hours

Reflow @ 260°C * 3times

 Pass J-STD-020E
uHAST

130°C, 85%RH

33.3 psia, unbiased 192 hours

 Pass JESD22-A118B

 

Beta Site Performance in HJ**

Property / Product Unit  Commercial Hysol GR920 A1
UNCURED PROPERTIES
Epoxy Type   - BP
Hardener Type   - PN/MF
Filler cut µm 20 20
Filler content % 88 87.5
Hot Plate Gel time, @ 175°C s 30 46
Spiral Flow @ 175°C cm 99 167
TYPICAL CURED PROPERTIES
Glass Transition Temperature, TMA °C 142 150
Glass Transition Temperature, DMA °C 150 151
Coefficient of Thermal Expansion (CTE) α1, TMA ppm/°C 9 9
Coefficient of Thermal Expansion (CTE) α2, TMA ppm/°C 37 34
Flexural Strength @25°C MPa 175 1138
Flexural Modulus @25°C MPa 19500 21000
 Storage Modulus by DMA @25°C Mpa 25000 24000
 Storage Modulus by DMA @175°C Mpa 3000 2000
 Storage Modulus by DMA @260°C Mpa 1200 1100
Water Absorption, 24hr PCT % 0.38 0.38
Mold Shrinkage after PMC % 0.18 0.19
Hardness Shore D 83 80

 

 

Package Mold Cap Strip Size Package Size Die Size Bump Height
FCCSP 0.37 mm 240 * 76.3 * 0.18 mm 14 * 14 mm  6 * 6* 0.12mm 80 µm
 
Item Hysol GR910 L20
Appearance
C-Scan
T-Scan
Strip Warpage

2 mm
Marking OK
Test Item Qualification Test Condition Test Results Test Criterion
Before Test / Pass NA
Pre-conditioning


Baking: 125°C, 24 hours

Moisture Soak: 30°C/60%RH, 192 hours

Reflow @ 260°C * 3times

 Pass J-STD-020E
uHAST

130°C, 85%RH

33.3 psia, unbiased 192 hours

 Pass JESD22-A118B
TCB -55°C~125°C, 1000 cycles Pass JESD22-A104E