Hysol MG21F-02 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol MG21F-02 | Black Epoxy Mold Compound

Main features

Amazing HTRB performance
Excellent adhesion to Sn, Si and Cu
Encapsulation of low voltage diodes

Product Description

Hysol MG21F-02 is a high productivity, low cost, epoxy molding compound, designed specifically for high volume encapsulation of low voltage diodes and small signal transistors. It offers excellent reliability & HTRB data and has been used for diode bridge, axial diodes, diode metal electrode leadlesss face (MELF) and other high voltage and discrete semiconductor packages. It offers excellent adhesion to Sn, Si and Cu and amazing HTRB performance.

Hysol MG21F-02 performs very well during high-temperature reverse bias testing for devices running up to 800V and at 150°C. The largest cause of failure of epoxy molding compounds on these devices is the result of gate leakage and then ultimately catastrophic run-away current when tested under bias at temperature. MG21F-02 performs very well under these conditions. The CTI (comparative tracking index) of the MG-21F-02 is 325V.

Hysol MG21F-02 was developed many years ago, but is still one of the best EMC on the market for diodes, bridges and high voltage diodes. Many competitors have tried and failed to compete against this MG21F-02. Those that did manage to meet the same performance targets as the MG21F-02 did so at prices that were nearly twice that of the MG21F-02, leaving this product leading with an excellent price/performance correlation. Typical applications and uses of MG21F-02 include but are not limited to 28, 28 and 56 pin DL TSSOP, SOT, SOIC, PDIP and other power discrete and high voltage semiconductor packages.

We are currently developing the Green version of this product, to ensure it does not contain TBBP-A or antimony trioxide while also maintaining its flame retardant and electrically stable properties. Contact us for more information.

Product Family
MG21F-02

1. Select Product Form

Pellet

2. Available Pellet Size

40 mm

3. Available Pellet Weight

40 gr 31 gr

4. Available Package Size

15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

In stock

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

71 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.81

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	365 days

Physical Properties

Spiral Flow @ 175°C

65 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	6 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	1 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	4 ppm

Moisture absorption

0.22 %

Electrical Properties

Dielectric Constant

Dielectric Constant
Dielectric Constant (k), commonly known as relative permittivity, is a number relating the ability of a material to carry alternating current to the ability of vacuum to carry alternating current.

It determines the ability of an insulator to store electrical energy and is the ratio of electric permeability in vacuum against the electric permeability of a material.

The lower the dielectric constant (κ) and dissipation factor, the less energy is absorbed from an electric field, making it a much better insulator.

It is a dimensionless property that can be affected by various factors such as the thickness uniformity of a material, insufficient contact between the sample and electrodes, water adsorption and contact resistance.

Dielectric Constant @ 25 ˚C/1000 kHz

3.6

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

2.0x10¹⁶ Ohms⋅cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 21°C Flexural Modulus @ 21°C Flexural Modulus taken at 21°C	13,726 N/mm2
Flexural Modulus @ 25°C	14,710 N/mm2
Flexural Modulus @ 260°C Flexural Modulus @ 260°C Flexural Modulus taken at 260°C	1,268 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	127 N/mm2

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C	85

Molded Shrinkage

0.23 %

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	4.5

Storage (DMA) Modulus
Storage (DMA) Modulus @ 175°C	9,416 N/mm2
Storage (DMA) Modulus @ 25°C	14,285 N/mm2
Storage (DMA) Modulus @ 260°C	1,308 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	21 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	62 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	22 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

179 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.7 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F (Automold)	50 - 70 s
Curing Time @ 175°C / 347°F (Conventional Mold)	70 - 90 s
Mold Temperature	160 - 190 °C
Preheat Temperature	75 - 95 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	2 - 6 hrs

Transfer Pressure

35 - 105 kg/cm2

Transfer Time

12 - 25 s

Additional Information

Comparison of MG21F-02 with new Halogen-Free, Green GR21F-02 formulations

Ionic Conductivity vs Temperature for halogen-free versions of MG21F-02 — Judging from the "Ionic conductivity VS Temperature figure", halogen-free products GR21F-02, GR21F-02F4, GR21F-02F4A and GR21F-02F4B have similar electrical stability as MG21F-02 up to 200℃.

		MG21F-02	GR21F-02	GR21F-02F4	GR21F-02F4A	GR21F-02F4B
Formula Enhancement	Flame Retardant	TBBP-A & Antimony Trioxide	Not Contained	Green Flame Retardant X	Green Flame Retardant X+	Green Flame Retardant X+
Formula Enhancement	Ion Capture	Not contained	Not Contained	Ion Capture A Ion Capture B	Ion Capture A Ion Capture B	Ion Capture A+
Expectation	Halogen-free	-	✓	✓	✓	✓
	UL94 V-0 (1/8 inches)	✓	-	✓	✓	✓
	Improved Electrical Stability	✓	-	✓	✓	✓

Comparative Tracking Index

Test method: WI HHE Q A.6-124 (3.0mm Thickness)

Voltage (V)	#	Drop To Track	Oservation	Average
300	1	100	Eroded	100
	2	100	Eroded
	3	100	Eroded
	4	100	Eroded
	5	100	Eroded
350	1	86	Eroded	48
350	2	10	Flamed	48
325	1	100	Eroded	100
	2	100	Eroded
	3	100	Eroded
	4	100	Eroded
	5	100	Eroded

CTI(V) = 325

Customer reliability tests - Not Hysol Specifications

Diode type: TVS 500V/1,5μA

Standard Assembly process
HTRB test / Reliability
Temperature: 140°C
Reverse Bias: 375V
Duration: 24h

Compound / Colour Code	Molding Temperature (°C)	Transfer Time (sec)	Curing Time (sec)	Pre-heating (sec)	Post-Curing (h)
Product A	190	15	110	25 (0.4A)	8 @ 175°C
MG21F-02	185	25	60	24 (0.4A)	6 @ 175°C