Sn96.5Ag3.5 | Eutectic Pbfree Solder Spheres
- Leadfree Solder Spheres
- Eutectic Melting Temp of 221°C (430°F)
- The highest Joint Reliability
Product Description
LINQALLOY Sn96.5Ag3.5 Eutectic Leadfree Solder Spheres Solder Spheres are lead-free Tin/Silver alloys that contain 96.5% Tin (Sn) and 3.5% Silver (Ag) and is often written as Sn96.5Ag3.5. Sn96.5Ag3.5 Eutectic Leadfree Solder Spheres are not as common as the 4% silver alloy, but are sometimes used due to the eutectic melting temperature of 221°C (the 4% version does not have a eutectic temperature). These lead-free solder balls are used by companies working with BGA, CSP, LBGA, PBGA and CBGA components who have made the transition to Lead-free (Pb-free) soldering.
Features:
- Eutectic Melting Temperature of 221°C (430°F)
- High Silver solders have the Highest Joint Reliability
- Compatible with all Flux Types
- Best Wetting Sn/Ag/Cu Alloy
Each jar has a clear label on the lid specifying the solder ball diameter as well as a label on the front identifying the alloy type, the quantity of spheres in the jar, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is also provided with the solder spheres and ensures the Sn96.5Ag3.5 solder spheres meet the following quality criteria:
- Tin (Sn): 96.5%
- Silver (Ag): 3.5%
- Eutectic Melting Temperature: 221°C
- Spheroid Tolerance : Within 1.5%
Diameter Tolerance
- 0.075mm - 0.15mm (3-6 mils) : ±0.005mm (±0.2 mils)
- 0.20mm - 0.60mm (8-24 mils) : ±0.010mm (±0.4 mils)
- 0.65mm - 0.76mm (25-30 mils) : ±0.015mm (±0.6 mils)
Technical Specifications
General Properties | |||||||
Alloy Composition Alloy Composition Composition of the alloy material | Sn96.5Ag3.5 | ||||||
Alloy Type Alloy Type A metallic element type | Sn96.5Ag3.5 | ||||||
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 7.50 g/cc | ||||||
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Mechanical Properties | |||||||
Elongation Elongation Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break. | 24 % | ||||||
Thermal Properties | |||||||
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Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 59 W/m.K | ||||||
Other Properties | |||||||
RoHS Compliant RoHS Compliant RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions | Yes |
Additional Information
What do I get when I buy Sn96.5Ag3.5 Eutectic Solder Spheres from CAPLINQ?
The advantage of ordering solder spheres online at CAPLINQ.com is that you can be sure of the quality. The solder spheres you receive are originally manufactured solder spheres packed into jars with inert gas (nitrogen). We do not repack the solder balls we receive, so the jars you will receive have never been opened, thus ensuring the quality of the product you receive. The lid of the jar is also always sealed with a shrink-wrapped plastic wrap ensuring that the solder spheres do not oxidate in the jar.