Bi58Sn42 | Eutectic Pbfree Solder Spheres
- Leadfree Solder Spheres
- Lowest Cost Eutectic (138°C) Solder
- Low-Temperature Eutectic Solder
Product Description
LINQALLOY Bi58Sn42 Low-temperature eutectic solder spheres are lead-free Bismuth-Tin alloys that contain 58% Bismuth (Bi), 42% Tin (Sn) and are often written as 58Bi42Sn, Sn42Bi58, or 42Sn58Bi. Bi58Sn42 Solder Spheres are low-temperature, lead-free, eutectic solder spheres and are used by companies working with BGA, CSP, LBGA, PBGA and CBGA components who have made the transition to Lead-free (Pb-free) soldering.
Features:
- Lowest Cost Eutectic (138°C) Solder
- Low-Temperature Eutectic Solder compared to Tin-Silver
- Compatible with many Flux Types
- Lead-free
Diameter Tolerance
- 0.075mm - 0.15mm (3-6 mils) : ±0.005mm (±0.2 mils)
- 0.20mm - 0.60mm (8-24 mils) : ±0.010mm (±0.4 mils)
- 0.65mm - 0.89mm (25-30 mils) : ±0.015mm (±0.6 mils)
Technical Specifications
General Properties | |||||||||||||
Alloy Composition Alloy Composition Composition of the alloy material | Bi58Sn42 | ||||||||||||
Alloy Type Alloy Type A metallic element type | Bi58Sn42 | ||||||||||||
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 8.56g/cc | ||||||||||||
Spheroid Tolerance Spheroid Tolerance The allowed % that a solder ball (solder sphere) can divert from being perfectly round and spherical. We take one lot of solder spheres and divide it into 4 smaller lots. Each lot is then checked with advanced visual inspection systems. If even 1 ball is out of spec, the entire batch is scrapped and reworked! | 1.5 % | ||||||||||||
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Thermal Properties | |||||||||||||
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Other Properties | |||||||||||||
RoHS Compliant RoHS Compliant RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions | Yes |
Additional Information
The solder spheres you receive are originally manufactured solder spheres packed into jars with inert gas (nitrogen). We do not repack the solder balls, so the jars you will receive have never been opened, thus ensuring the quality of the product. The lid of the jar is also always sealed with a shrink-wrapped plastic wrap ensuring that the solder spheres do not oxidate in the jar.
Each jar has a clear label on the lid specifying the solder ball diameter as well as a label on the front identifying the alloy type, the quantity of spheres in the jar, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is provided with the solder spheres and ensures the Bi58Sn42 solder spheres meet the following quality criteria:
- Tin (Sn): 42%
- Bismuth (Bi): 58%
- Eutectic Temperature: 138°C
- Melting Temperature (Solidus): 138°C
- Melting Temperature (Liquidus): 138°C
- Spheroid Tolerance : Within 1.5%