JNC PI-6673-002 | Insulating Polyimide Ink

Harmonization Code : 3908900090 | Polyamides in Primary form

JNC PI-6673-002 | Insulating Polyimide Ink

Main features

Thermal Curable
Low Temperature Curing
Low Warpage

Product Description

PI-6373-002 is a low-temperature cured insulating polyimide ink specially designed to meet the demands of high thermal applications, which provide solution for heat resistance and insulation applications.

PI-6673-002 is engineered to be a thermally curable polyimide ink with remarkable insulating properties making it ideal choice for electrical isolation and heat management applications. Its polyimide-based chemistry brings forth the balance between flexibility and resilience. PI-6373-002 features a residual stress of 15 MPa and a coefficient of thermal expansion (CTE) of 146 ppm/K, ensuring compatibility with various materials and minimizing the risk of performance-altering mismatches. Moreover, with a

breakdown voltage of 200 V/um and a dielectric constant of 2.8 @ 1 kHz, ensuring stable electrical isolation and signal integrity for your components.

Industry Applications:

Electronics Manufacturing | Consumer Electronics | Sensors and IoT Devices

Cure condition

175⁰C in 60 min

Specifications
Additional Information

Technical Specifications

General Properties

Process Method

Inkjet

Solids

25 %

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

9 mPa.s

Chemical Properties

Water Absorption

0.5 %

Electrical Properties

Breakdown Voltage

Breakdown Voltage
Breakdown voltage is the minimum voltage necessary to force an insulator to conduct some amount of electricity.
It is the point at which a material ceases to be an insulator and becomes a resistor that conducts electricity at some proportion of the total current.

After dielectric breakdown, the material may or may not behave as an insulator any more because of the molecular structure alteration. The current flow tend to create a localised puncture that totally alters the dielectric properties of the material.

This electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film.

200 V

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

2.0x10¹⁶ Ohms⋅cm

Mechanical Properties

Elongation

Elongation
Elongation is the process of lengthening something.

It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.

It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.

15 %

Thermal Properties

Coefficient of Thermal Expansion (CTE)

Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.

Coefficient of Thermal Expansion (CTE), α1

Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.

146 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

140 °C

Additional Information

Is Polyimide compatible with SiN substrates?

We have not evaluated the wettability against SiN substrate. Wettability varies depending on the oxidation state and treatment state of the surface, so we cannot give a generic, catch all, answer.

Properties	PI-6673-002
Solids content (wt. %)	25
Viscosity (mPa's) @25℃	9
Surface tension (mN/m) @23℃	28
Printing methods	Inkjet
Curing	175℃ 60min
Post-curing	-
Volume resistivity (Ω*cm)	2E+16
Breakdown voltage (V/um)	200
Dielectric constant (1kHz) @1V	2.8
Tensile modulus (MPa)	960
Elongation (%)	15
Residual stress (MPa)	15
5% weight loss temp (℃)	368
CTE (	146
Tg (℃)	140
Water absorbance (%) @23℃	0.5