LINQALLOY SP-SAC307 | Solder paste

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • Sn99Ag0.3Cu0.7 Alloy
  • 217 - 228°C
  • Powder size: T3, T4 and T5

Product Description

LINQALLOY SP-SAC307 is a lead free, no clean, solder paste, comprised of 99% tin, 0.3% silver, 0.7% copper that has been designed for Surface Mount Technology(SMT). No-Clean Solder Paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues.

LINQALLOY-SP-SAC307 solder paste is crafted with refined tin powder that allows for exceptional printing capabilities and minimal oxide content. This solder paste has enhanced flux content (higher %) that guarantees higher reliability. With its low iconic activator system it leaves behind minimal residues post reflow resulting in exceptionally high insulation resistance and excellent reliability

Product Family
SP-SAC307  
T4 powder
0.5Kg Jar

Catalog Product

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Technical Specifications

General Properties
Metal Loading
Copper (Cu)
Copper (Cu)
Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
0.7 %
Silver (Ag) 0.3 %
Tin (Sn) 99 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 180 days
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
210 mPa.s