LINQALLOY SP-SAC307 | Solder paste
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- Sn99Ag0.3Cu0.7 Alloy
- 217 - 228°C
- Powder size: T3, T4 and T5
Product Description
LINQALLOY SP-SAC307 is a lead free, no clean, solder paste, comprised of 99% tin, 0.3% silver, 0.7% copper that has been designed for Surface Mount Technology(SMT). No-Clean Solder Paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues.
LINQALLOY-SP-SAC307 solder paste is crafted with refined tin powder that allows for exceptional printing capabilities and minimal oxide content. This solder paste has enhanced flux content (higher %) that guarantees higher reliability. With its low iconic activator system it leaves behind minimal residues post reflow resulting in exceptionally high insulation resistance and excellent reliability
Technical Specifications
General Properties | |||||||||
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Physical Properties | |||||||||
Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application | 210 mPa.s |