LINQALLOY SP-SAC105 | Solder paste

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • Pb-free Sn98.5–Ag1–Cu0.5 alloy
  • Solder paste for surface mount technology
  • RoHS compliant

Product Description

LINQALLOY SP-SAC105 is a Pb-free solder paste composed of 98.5% Sn, 1% Ag, and 0.5% Cu. It has been designed for surface mount technology (SMT). SP-SAC105 is being offered in two options: No-Clean and Water-Soluble. No-clean solder paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues. On the other hand, the water-soluble solder paste is crafted with refined tin powder that allows you to clean flux residue left after the reflow process.

LINQALLOY SP-SAC105 is produced using refined Sn powder and minimal oxide content, enabling exceptional printing capabilities. Our SAC105 solder paste offers a compelling combination of properties for reliable and high performance electronics assembly.

 

Product Family
SP-SAC105  
NC | T4 Powder
0.5kg Jar

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Metal Loading
Copper (Cu)
Copper (Cu)
Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
0.5 %
Silver (Ag) 1 %
Tin (Sn) 98.5 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 180 days
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
200±20 mPa.s

Additional Information

Recommended reflow soldering temperature profile

Recommended reflow soldering temperature profile