LINQALLOY STLF | Stamped lead frame

Harmonization Code : 8541900000 |   Semiconductor devices (for example, diodes, transistors, semiconductor-based transducers); photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED), whether or not assembled with other light-emitting diodes (LED); mounted piezo-electric crystals -Pa
Main features
  • LQFP, PDFN, TSSOP, SOP, SSOP, ESOP, SOT, SOD, TO, CLIP, IPM
  • Leadframe width from 25mm to 100mm
  • Leadframe pin count from 2L to 64L

Product Description

LINQALLOY STLF Stamped lead frames serve as the structural backbone for advanced semiconductor packaging, enabling the production of compact and high-performance electronic devices. This lead frame manufacturing method provides a robust and cost-effective solution for integrating complex packaging designs while ensuring high precision and repeatability.

Stamped semiconductor lead frames are produced through a high-speed stamping process, in which progressive dies are used to mechanically punch and shape the metal strip into intricate lead frame configurations. This method is particularly well-suited for high-volume production, offering excellent consistency and structural integrity.

The stamping process involves feeding a continuous metal strip through a precision die set, where multiple operations such as punching, bending, and coining are performed in rapid succession. This process ensures the efficient formation of lead frames with fine features and tight tolerances. Post-processing steps may include plating for enhanced electrical performance, surface treatments for improved adhesion, and additional roughening techniques to meet high-reliability requirements.

Product Family
STLF  

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

Additional Information

High costs for the initial tooling and its subsequent maintenance are associated with lead frames that are made in large quantities; these costs are justified by the need for the highest possible productivity for low unit cost. Lead frame stamping is conducted on reel-to-reel lines using very high-speed precision presses and tungsten carbide progressive stamping dies. Tool life is crucial for successful manufacturing economics and alloys that permit long, uninterrupted production without causing excessively worn or broken punches are favored. High pin count lead frames, such as for QFP, are also made from thinner strip. Leads become progressively more tightly spaced around the die pad with increasing pin count since limitations on wire bonding do not allow the ends of the inner leads, to which the wires are attached, to be made more narrow. Thinner strip facilitates the stamping of smaller interlead separations that are necessary to accommodate larger numbers of leads. The practical, high-end limit on pin count for stamped lead frames is 64 leads (for QFP). This limitation is imposed more by significantly higher tooling cost and by the cost-competitive alternatives of no-lead packages than by added difficulty in stamping more densely spaced leads.
Stamped leadframe

Discrete Device Leadframes

Package Type No. of Leads Copper Alloy
SOD123 / SOD323 2L C194, C19210, C7025, CAC5, EFTEC64T, BYP27
SOT23 3L / 5L / 6L C194, C19210, C7025, CAC5, EFTEC64T, BYP27
SOT223 2L / 3L C194, C19210, C7025, CAC5, EFTEC64T, BYP27
SOT323 5L / 6L C194, C19210, C7025, CAC5, EFTEC64T, BYP27
SOT363 6L C194, C19210, C7025, CAC5, EFTEC64T, BYP27
SOT523 3L C194, C19210, C7025, CAC5, EFTEC64T, BYP27
SOT26 6L C194, C19210, C7025, CAC5, EFTEC64T, BYP27
SOT143 4L C194, C19210, C7025, CAC5, EFTEC64T, BYP27
SOT89 2L / 3L C194, C19210, C7025, CAC5, EFTEC64T, BYP27

 

Integrate Circuit Leadframes

Package No. of Leads Copper Alloy
DIP 26L / 27L C194, C19210, C7025
SOP 6L / 7L / 8L / 16L C194, C19210, C7025
TSOP 6L C194, C19210, C7025
DTSOP 7L C194, C19210, C7025
ESOP 8L / 16L C194, C19210, C7025
PSOP / MSOP 8L C194, C19210, C7025
QSOP 24L C194, C19210, C7025
SSOP 10L / 24L C194, C19210, C7025
TSSOP 8L / 20L C194, C19210, C7025
ETSSOP 20L C194, C19210, C7025
PDFN 8L C194, C19210, C7025
LQFP 32L / 48L / 64L C194, C19210, C7025

Power Leadframes

Package No. of Leads Copper Alloy
TO252 3L / 5L C19210