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- LINQBOND DA-8410 | Die-Attach
LINQBOND DA-8410 | Die-Attach
- High Thermal Conductivity
- High Reliability
- Pressureless sintering
Product Description
LINQBONDTM DA-8410 is a silver sintering die attach paste with excellent adhesion on bare Cu substrates, as well as other metal plated substrates. Pressureless sintering is achieved at 250 °C, providing excellent adhesion and leaving no organic residues, resulting in high thermal conductivity and reliability.
LINQBONDTM DA-8410 is designed as a die attach material for applications requiring high thermal and electrical conductivity. Typically used for high thermal resistance assemblies such as LEDs, laser diodes, RF devices, automotive electronics, and power devices.
Technical Specifications
| General Properties | |||||
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| Work life @25°C Work life @25°C Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements. | 24 hours | ||||
| Physical Properties | |||||
| Thixotropic index Thixotropic index Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material. | 5.9 | ||||
| Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application | 40000 mPa.s | ||||
| Mechanical Properties | |||||
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| Thermal Properties | |||||
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| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 250 W/m.K | ||||
Additional Information
Cure schedule
Two-Step Curing Conditions (refer to the diagram below):
1st step: 5 °C/min ramp to 80 °C and hold for 30 min
2nd step: 5 °C/min ramp from 80 °C to 250 °C and hold for 60 min
Cool down: 5 to 10 °C/min cool down to room temperature
Precautions for Use
Allow the container to reach room temperature before use. Syringe should be placed vertically while thawing. Thaw process for 10 cc syringe takes 1 hour.
The adhesive cannot be refrozen once exposed to room temperature.
To ensure uniform and stable viscosity, syringe can be placed in planetary mixer for 2 min at 800 rpm.
Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.