LINQBOND DA-9010S | Sintering Die-Attach

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • PFAS free
  • Lead-free die attach
  • SiC and GaN high power applications

Product Description

LINQBOND DA-9010S is a single-component, pressure-less silver sintering die attach. It has exceptional adhesion to bare Cu, and Au and Ag plated substrates. Full silver sintering can be achieved at 250°C exhibiting high electrical, thermal conductivity, and high reliability. 

LINQBOND DA-9010S is typically used as die attach or lead-free solder alternative for high-power applications using SiC and GaN chips capable of operating at high voltages and temperatures such as RF base stations, EV charging, Photovoltaic (PV), Consumer Electronics, Aerospace and Defense. It can be used in various semiconductor packages such as SOT, TO, QFN, SOP, and IGBT.

 

Cure Schedule

  • Ramp to 80°C and hold for 30 min + ramp to 250°C and hold for 90 min

    • Ramp rate 5°C/min

    • Cool down rate 5°C to 10°C

 

Product Family
DA-9010S  
30cc EFD syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
No longer available No longer available No longer available
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Filler Content 88 %
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
 24 hours
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -20°C 183 days
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 5.8
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 70000 mPa.s
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 5.6x100 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 20 ppm/°C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 210 W/m.K