LINQBOND UF3501R | Reworkable Underfill

Product Description

LINQBOND UF3501R is a one-component epoxy adhesive designed for rework in electronic device bonding. This product offers excellent operability and is suitable for potting, casting, and sealing various electronic components. It cures quickly at high temperatures, reducing working time and increasing efficiency. The product forms a tough, strong structure with excellent shear, peel, and impact strength.

LINQBOND UF3501R its durability is of a very high level, capable of passing multiple environmental tests. When used for underfilling CSP and BGA chips, it helps buffer the expansion and contraction stress of solder ball contacts, as well as the shear force caused by reaction forces during drop tests.