LINQBOND UF3550R | Reworkable Underfill

Product Description

UF3550R is a reworkable one-component epoxy adhesive designed for electronic device bonding. It is easy to use and suitable for various electronic components, including casting and sealing. This resin cures quickly at high temperatures, reducing working time and increasing efficiency simultaneously.

UF3550R forms tough, strong structural bonds with excellent shear, peel, and impact strength. The resin's durability is exceptional, passing numerous environmental tests. When used for underfilling CSP and BGA chips, it buffers the expansion and contraction stress of solder ball contacts and mitigates the shear force generated by reaction forces during drop tests.