LINQBOND UF3801 | Underfill
Main features
- solvent-free
- low viscosity
- one-component
Product Description
LINQBOND UF3801 is a one-component epoxy adhesive designed for electronic device bonding. It is easy to use and suitable for various applications, such as casting and sealing electronic components. This resin cures quickly at high temperatures, reducing working time and increasing efficiency.
LINQBOND UF3801 forms tough, strong structural bonds that offer excellent shear, peel, and impact strength. The durability of this resin is exceptionally high, and it can successfully pass numerous environmental tests.