LINQBOND UF3803 is a one-component epoxy resin designed for flip-chip packaging in electronic products. It is easy to use and suited for various applications, such as casting, sealing, and encapsulation of electronic components.
LINQBOND UF3803 cures quickly at high temperatures, reducing working time and increasing efficiency. It forms tough, strong structural bonds that offer excellent shear, peel, and impact strength. The resin's durability is exceptionally high, and it can successfully pass numerous environmental tests.
