LINQSOL EMC-7142 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-7142 | Black Epoxy Mold Compound

Main features

Green epoxy molding compound
Designed for SOP and QFP
Low water absorption, low stress, and excellent moldability

Product Description

LINQSOL EMC-7142 is a green epoxy molding compound series specifically developed for the encapsulation of small outline packages (SOP) and quad flat packages (QFP). Its high spiral flow at 175 °C satisfying the required standards for SOP and QFP molding. LINQSOL EMC-7142 has low modulus that meets low-stress requirements. Additionally, with a UL 94 V-0 flammability rating and low water absorption.

EMC-7142 guarantees strong performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Previous packages using EMC-7142R met the MSL 1 preconditioning requirements successfully. Overall, LINQSOL EMC-7142 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

LINQSOL EMC-7142 series delivers robust performance and flexibility. Choose from standard (Type S) or low wire sweep (Type L) versions, both qualified in popular package options (SOP8, SOP14, SOP16) and meeting MSL3 requirements. With over 350 shots of moldability, these devices are designed for long-lasting reliability. Higher reliability variants (EMC-7142 and EMC-7142 Type H) are currently under development and evaluation.

Key Features

Good moldability performance.
Good flowability without wire sweep.
Good adhesion performance on Cu/Ag leadframe.
Good reliability performance on SOP package.
Low water absorption to meet MSL3 to MSL 1 requirements.
Meets UL94 V-0 flammability.
Green material without Br/Sb in compliance with ROHS.

Available Versions

EMC-7142 (Standard)
EMC-7142 Type L (Low Stress)
EMC-7142 Type R (MSL 1 Capable)
EMC-7142 Type H (High Voltage up to 900V Packages)

Product Family
EMC-7142

1. Select Pellet Weight

4.3 gr

2. Available Pellet Size

14 mm

3. Available Product Form

Pellet

4. Available Package Type

15kg box

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 6 - 8 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

87 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.0

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Physical Properties

Spiral Flow @ 175°C

116 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	15 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	15 ppm

Water Absorption

0.3 %

Electrical Properties

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
Conductivity	0.018000000000000002 mmhos/cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	24500 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	150 N/mm2

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	6.5

Shear strength
Tab Pull Adhesion Strength on Ag (MSL3)	4.61 MPa
Tab Pull Adhesion Strength on Cu (MSL3)	4.12 MPa

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	38 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	29 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

123 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F	90–120 s
Mold Temperature	170–180 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	4–6 hrs

Transfer Pressure

40–90 kg/cm2

Transfer Time

10–35 s

Additional Information

LINQSOL EMC 7142 Series Property Comparison

PROPERTY	UNIT	EMC-7142	EMC-7142L	EMC-7142R	EMC-7142H
Resin Type	-	MAR + Low Stress	MAR	MAR	MAR + New
Filler Type	-	Spherical	Spherical	Spherical	Spherical
Filler Content	%	87	87	88	88
Specific Gravity	-	2.0	1.99	2.0	2.0
Spiral Flow @175°C	cm	116	119.4	90	101.6
Hot Plate Gel Time @175°C	sec	29	27	30	28
Glass Transition Temperature	°C	123	127	122	128
CTE 1, α1 CTE 2, α2	ppm ppm	8 38	9 37	8 34	8 37
Flexural Strength @25°C Flexural Modulus @25°C	MPa Gpa	150 24.5	140 24	160 24.8	150 24
Dielectric Strenght	KV/mm	13	13	14	14
Water Absorption	%	0.15	0.3	0.18	0.26
Adhesion Strength at Cu substrate after Post Mold Cure Adhesion Strength at Ni substrate after Post Mold Cure Adhesion Strength at Cu substrate after MSL3 Preconditioning Adhesion Strength at Ag substrate after MSL3 Preconditioning Adhesion Strength at Ni substrate after MSL1 Preconditioning	MPa MPa MPa MPa MPa	- 0.465 4.61 4.12 -	- 0.422 5.32 4.15 MPa	7.7 2.62 4.58 4.15 1.27	- 2.53 4.58 5.9 1.39
Comments		STD/MSL3	Lower wire sweep	MSL 1	High Voltage up to 900V Packages

LINQSOL EMC-7142 Reliability Test Results for Small Outline Packages (SOP)

Device Information

Package Type	8SOP-225
Epoxy	XXX1076XX
Leadframe	8SOP-225 (90 × 90); 8 × 32 SLF Cu
Wire	0.9 mm HS-RF2
Epoxy Mold Compound	LINQSOL EMC-7142 (14 mm, 3.4 g)

Test Conditions

Test Item	Condition	Duration	Quantity
Pre-conditioning	Bake (125 °C) Soak (30 °C, 60% RH) Reflow (260±5 °C)	24 h 192 h 3 times	90 each


TCT	–65 to 150 °C	500 cycles	45 each
PCT	121 °C, 100% RH, 2 atm	96/168 h	45 each
HTS	150 °C	1008 h	45 each

Reflow Profile

Step	Profile Feature	Condition/ Duration
1	Minimum Temperature (Tsmin) Maximum Temperature (Tsmax) Time (ts) from Tsmin to Tsmax	150 °C 200 °C 60–120 s
2	Ramp-up Rate (TL to TP)	3 °C/s (maximum)
3	Liquidus Temperature (TL) Time (tL) maintained above TL	217 °C 60–150 s
4	Peak Package Body Temperature (TP)	260±5 °C
5	Time (tp) within 5 °C of the Specified Classification Temperature (TC)	30 s
6	Ramp-down rate (TP to TL)	6 °C/s (maximum)
7	Time 25 °C to Peak Temperature	8 min maximum

Scanning Acoustic Tomography Results

Test Item	SAT Result (Fail Units/Total Units)			Test Result
	Top Chip	Top Leadframe Pad	Inner Lead
Before	0/30	0/30	0/30	PASS
After MSL3	0/30	0/30	0/30	PASS

Scanning Acoustic Tomography Images

Test Item		Images
Pre-conditioning	Before
Pre-conditioning	After

Conclusion on EMC7142 Reliability Test Performance

All 8SOP-225 devices passed the reliability test without any failure.

Test Item	In	Out	Yield	Test Result
Preconditioning	90	90	100%	PASS
TC (500 Cycles)	45	45	100%	PASS
PCT (96 h)	45	45	100%	PASS
PCT (168 h)	45	45	100%	PASS
HTS (1008 h)	45	45	100%	PASS

LINQSOL EMC-7142 Moldability Test Results

Beta Site (G) Performace of EMC-7142

Device Information

Package Type	SOP8(12R)
Epoxy Mold Compound (EMC)	EMC-7142
Die Size	0.56*0.405 mm
Die Thickness	300±20 μm
Pad Size	62*62 μm
Pad Pitch	80 μm
Lead Frame	Silver Plated Copper
Wire	0.8mil/Cu20μm

Continuous Molding using EMC-7142 on SOP8

Molding Shot	SAT Images	Remarks
First mold		PASS
100th		PASS
150th		PASS
200th		PASS
250th		PASS
300th		PASS
330th		PASS
369th		PASS

Reliability Test Results after Continuous Molding using EMC-7142 on SOP8

Test Items	Test Conditions	SAT Images	Results
Preconditioning MSL 3 + TCT 200 cycles	SAT1 Bake: 125°C, 24h Soak: 60°C, 60%RH, 40h Reflow: 260°C, 3 times TCT 200 cycles (-65~200°C) SAT2		PASS

Test Items

Test Conditions

SAT Images

Results

Preconditioning MSL 3

TCT 200 cycles

SAT1
Bake: 125°C, 24h
Soak: 60°C, 60%RH, 40h
Reflow: 260°C, 3 times
TCT 200 cycles (-65~200°C)
SAT2

ReliabilityTestResults afterContinuousMoldingusingEMC-7142 on SOP8

PASS

Beta Site (S) Performace of EMC-7142

Package Type		SOP8
Lead Frame Density	8 rows * 32 columns	Lead Frame Type	Cu with Ag-plating
Mold Type	TOWA Y-1	Molding Temp (°C)	175
Preheat Time (sec)	3	T/F Pressure (ton)	1.3
Cure Pressure (ton)	55	T/F Time (sec)	10.2

Scanning Acoustic Tomography Results

No delamination after PMS/MSL3

Test Item		Images
Pre-conditioning	Before
Pre-conditioning	After

Wire Sweep Images

Spec ≤15%

Left (1.5%)	Center (2.2%)	Right (1.6%)

Reliability Test Results on Site (S)

Test Item	Condition	Result
SAT	MSL3 Bake(125°C) 24h, Soak (30°C, 60%RH) 192h, Reflow(260 +5/-0°C) 3 times	0/90
PCT	121°C, 100%RH, 2atm	0/45
TCT	-65°C - 150°C, 500 cycles	0/45
HTS	150°C, 1008h	0/45

LINQSOL EMC-7142 Type L Moldability Test Results

Beta Site (C) Performace of EMC-7142 Type L

Device Information

Package Type		SOP16
Lead Frame Density	12 rows * 20 columns	Lead Frame Type	Cu with Ag-plating
Wire	1.2 mil	Molding Temp (°C)	175
Preheat Time (sec)	3	T/F Pressure (ton)	1.3
Cure Pressure (ton)	55	T/F Time (sec)	10.2

Scanning Acoustic Tomography Results using EMC-7142 Type L

No delamination after PMS/MSL3

Test Item		Images
Pre-conditioning	Before
Pre-conditioning	After

Wire Sweep Images using EMC-7142 Type L

Spec ≤10%

Left (1.5%)	Right (1.6%)

Beta Site (G) Performace of EMC-7142 Type L

Device Information

Package Type	SOP14(12R)
EMC	EMC-7142 Type L
Die Size	0.43*0.43 mm
Die Thickness	300±20 μm
Pad Size	62*62 μm
Lead Frame	Silver Plated Copper
Wire	0.8mil/Cu20μm
Preconditioning	MSL3 + TCT 200 cycles

Continuous Molding using EMC-7142 Type L on SOP14

Molding Shot	SAT Images	Remarks
10th		PASS
150th		PASS
284th		PASS
350th		PASS

Reliability Test Results after Continuous Molding using EMC-7142 Type L on SOP14

Test Item	Condition	SAT Images	Result
Preconditioning MSL 3 + TCT 200 cycles	SAT 1 Bake: 125°C, 24h; Soak: 60°C, 60% RH, 40h; Reflow: 260°C, 3 times TC 200 cycles (-65°C to 200°C) SAT 2		PASS

Test Item

Condition

SAT Images

Result

Preconditioning MSL 3

TCT 200 cycles

SAT 1

Bake: 125°C, 24h;

Soak: 60°C, 60% RH, 40h;

Reflow: 260°C, 3 times

TC 200 cycles (-65°C to 200°C)
SAT 2

PASS

Processing Instructions

Before use, let LINQSOL EMC-7142 reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-7142 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.