LINQSOL EMC-9023 | Epoxy Mold Underfill

Harmonization Code : 3907300090 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms

Main features

Green epoxy molding compound
Epoxy mold undefill
Designed for FCBGA, FCCSP, SiP

Product Description

LINQSOL EMC-9023 series is a molded underfill (MUF) epoxy molding compound specifically developed for the encapsulation of flip chip ball grid arrays (FCBGA), flip chip chip scale packages (FCCSP), and system in packages (SiP). LINQSOL EMC-9023 has excellent flowability and low modulus that meets low-stress requirements. Additionally, with a UL 94 V-0 flammability rating and low ionic contents.

EMC-9023 guarantees good moldability and outstanding reliability performance. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL EMC-9023 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

Product Family
EMC-9023

1. Select Product Form

Pellet

2. Available Pellet Size

14 mm

3. Available Pellet Weight

4.2 gr

4. Available Package Size

15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

85 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.96

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Physical Properties

Spiral Flow @ 175°C

180 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	7 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	6 ppm

Moisture absorption

0.38 %

Electrical Properties

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
Conductivity	4 mmhos/cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	23.6 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	150 N/mm2

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	5.0

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	13 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	47 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	60 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

162 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F	100-120 s
Mold Temperature	170-180 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	6-12 hrs

Transfer Pressure

70-150 kg/cm2

Transfer Time

10-25 s

Additional Information

LINQSOL EMC-9023 Epoxy Mold Underfill Series

To simplify die-to-substrate connection and multilayer substrate or laminate, epoxy mold underfill is essential- combining underfill and over-molding the packages into one.

LINQSOL EMC-9023K

Standard epoxy mold underfill.

LINQSOL EMC-9023E

Low-stress epoxy mold underfill

Property	Unit	EMC-9023K	EMC-9023E
General Properties
Filler content	%	85	85
Filler sieving size	µm	20	20
Specific gravity	-	1.96	1.96
Spiral flow at 175°C	cm	180	190
Chemical Properties
Ion content - Chloride (Cl–)	ppm	7	7
Ion content - Sodium (Na+)	ppm	6	4
Water absorption (PCT 24hr)	%	0.38	0.35
pH of extract	-	5.0	5.0
Electrical conductivity of extract	µS⋅cm–1	4×10³	3×10³
Mechanical Properties
Flexural strength (25°C / 260°C)	MPa	150 / 25	145 / 21
Flexural modulus (25°C / 260°C)	GPa	23.6 / 11	23.6 / 9.8
Mold shrinkage	%	0.24	0.27
Thermal Properties
Glass transition temperature	°C	162	150
Coefficient of thermal expansion, α1	ppm/°C	13	11
Coefficient of thermal expansion, α2	ppm/°C	47	43
Gel time at 175°C	sec	60	56
Flammability	UL-94	V-0	V-0

Processing Instructions

Before use, let LINQSOL EMC-9023 compounds reach room temperature (23±5 °C) for 16 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 24 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-9023 series is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5°C is 183 days.

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.