LINQSOL EMC-9070 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

LINQSOL EMC-9070 | Molding compound for high MSL qfn packages

LINQSOL EMC-9070 | Black Epoxy Mold Compound

Main features

MSL1 260°C
Designed for QFN and DFN packages
Moisture Corrosion Resistance

Product Description

LINQSOL EMC-9070 is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of quad-flat no-leads (QFN) and dual-flat no-leads (DFN). Once molded and post-mold cured, this product provides optimum protection and reliability for these semiconductor devices.

LINQSOL EMC-9070 is a spherical silica filled (89%) EMC, typically used for QFN and DFN packages. QFN and DFN packages are low-profile packages that are MAP molded. This means that the packages are molded together in one large mold and then separated by cutting through the entire package. Epoxy molding compounds made for these types of packages must have a low warpage, and EMC-9070 is no exception. This product is formulated to have very low internal stress to reduce warpage, as well as low moisture absorption to increase MSL performance.

Key Features:

JEDEC MSL 1 @260°C
Low CTE (8ppm) and mold shrinkage (<0.2%)
Low moisture absorption (0.33% after PCT 96hrs@121°C)
Halogen-free (contains no br, Sb, P, etc.)
REACH and RoHS compliant
UL 94 V-0 Flammability

Application: QFN and DFN Packages

Product Family
EMC-9070

1. Select Product Form

Pellet

2. Available Pellet Size

14 mm

3. Available Pellet Weight

4.4 gr

4. Available Package Size

10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 6 - 8 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

black

Filler Content

89 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.01

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Physical Properties

Spiral Flow @ 175°C

127 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	4.1 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	6.7 ppm

Moisture absorption

0.33 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	26 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	160 N/mm2

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C	83

Molded Shrinkage

0.2 %

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	6.8

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	30 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	35 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

126 °C

Additional Information

PROPERTIES	UNITS	EMC-9070	EMC-9070SF	EMC-9070P
Epoxy Type	-	Biphenyl	Biphenyl	Biphenyl
Hardener Type	-	Hydrophobic	Hydrophobic	Hydrophobic
Flame Retardant	-	Metal Hydroxide	Metal Hydroxide	Metal Hydroxide
Filler Content	%	89	86	86.5
Filler Sieved Size	um	75	75	75
Specific Gravity	-	2.01	1.96	1.98
Spiral Flow @175°C	inches	50	79	54
Gel Time @175°C	seconds	35	40	24
Glass Transition Temperature	°C	126	126	126
CTE by TMA, α1	ppm/°C	8	13	11
CTE by TMA, α2	ppm/°C	30	45	39
Hot Hardness, 120 sec@175°C	Shore D	83	79	85
Flexural Strength @25°C	MPa	160	113	158
Flexural Modulus @25°C	GPa	26	21	23
Moisture Absorption, PCT 96hrs@121°C	%	0.33	0.40	0.40
Mold Shrinkage	%	<0.2	<0.3	<0.3
Ionic Impurities (20hrs @160°C) pH Na⁺ Cl^-	- ppm ppm	6.8 6.7 4.1	6.9 7.3 4.0	6.9 7.2 4.0
Comments		General product for most QFN packages	Long spiral flow with good warpage control for large L/F and panel	Short gel time with good warpage control for productivity