LOCTITE ABLESTIK 84-1LMINB1

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • Electrically conductive
  • Long work life
  • Bonds to difficult to wet surfaces

Product Description

LOCTITE ABLESTIK 84-1LMINB1 die attach/assembly adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitor terminations. This adhesive reduces capacitor shorting problems caused by resin bleed.

LOCTITE ABLESTIK 84-1LMINB1 meets the strict requirements of MIL-STD-883, Method 5011 and has very low NASA outgassing values. Namely 0.14% TML, 0.02% CVCM and 0.07% WVR.

Cure Schedule

  • 1 hour @ 150°C
Product Family
84-1LMINB1  
TECH Syringe EFD Syringe
1 cc 3 cc 5 cc

Catalog Product

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Technical Specifications

General Properties
Outgassing
CVCM
CVCM
Collected Volatile Condensable Materials
0.02 %
TML
TML
Total Mass Loss
0.14 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 365 days
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
24 hours
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
50,000 mPa.s
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
20 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
20 ppm
Water Extract Conductivity 9.7 Ohm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
50 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
130 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
90 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
3.9 W/m.K