LOCTITE ABLESTIK 84-1LMIT

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features

Electrically conductive
High thermal conductivity
MIL 5011 - NASA

Product Description

LOCTITE ABLESTIK 84-1LMIT epoxy adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. The T in the product name stands for Thermal since it has 2 times higher thermal conductivity (± 4W/mK) than the standard LMI version.

LOCTITE ABLESTIK 84-1LMIT meets the military requirements of MIL-STD883C, Method 5011 and also passes NASA outgassing requirements. It is an electrically and thermally conductive, solvent free adhesive with high purity and low outgassing.

Cure Schedule

1 hour @ 150°C

Product Family
84-1LMIT

1. Select Package Type

3CC Syringe 10CC Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications

Technical Specifications

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	30 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	2 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	10 ppm

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

7.0x10^-5 Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	52 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	200 ppm/°C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

4.3 W/m.K