LOCTITE ABLESTIK ABP 2032S

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • Low temperature cure
  • Good adhesion
  • Electrically conductive

Product Description

LOCTITE ABLESTIK ABP 2032S electrically conductive epoxy adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in small to medium die applications. It is a tried and proven product for optical sensor ASIC attach and for Lid attach for optical sensors and 3d sensing modules.

LOCTITE ABLESTIK ABP 2032S has good adhesion and good dispensing characteristics, This material can cure in temperatures as low as 80°C and works great on substrates such as Gold, Steel and Silver. 

Cure Schedule

  • 60 minutes @ 80°C
  • 3 minutes @ 150°C or
  • 10 minutes @ 120°C
Product Family
ABP2032S  
10cc Syringe
5 cc

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Type Heat Cure
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 365 days
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
 24 hours
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 4.5
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 11,000 mPa.s
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 30 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
 20 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 20 ppm
Mechanical Properties
Shear strength
Shear Strength @25°C 39 N/mm2
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @100°C 1,200 N/mm2
Tensile Modulus @200°C 150 N/mm2
Tensile Modulus @25°C 4,600 N/mm2
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 1 W/m.K