LOCTITE ABLESTIK ABP 8142B

Harmonization Code : 3910.00.00.90 |   Silicones in Primary Forms; Others
Main features
  • Low and stable modulus
  • Snap cure or oven cure
  • MEMs package applications

Product Description

LOCTITE ABLESTIK ABP 8142B non-conductive die attach adhesive is designed for MEMs package applications. It has low bleed and a stable modulus in a range between -30 to 200 degrees celcius, resulting in stable stress, making it ideal for pressure sensor applications. Its silicone chemistry should be able to withstand >300°C for a short time if the application requires it.

LOCTITE ABLESTIK ABP 8142B is a flexible, non corrosive silicone based adhesive that is stable in high temperatures. It can potentially withstand reflow temperatures and follow thermal deformations but we advise the customers to test it for their application. It has a relatively low outgassing of 1.42% at 150°C for 60mins.

Please advise the Data package in the Documents section for extensive test results regarding work life, dispensing, bleeding, warpage, adhesion and other properties.

Cure Schedule

  • 30 minutes @ 150ºC
Product Family
ABP8142B  
5cc in 10cc EFD

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Type Snap Cure
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
 24 hours
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 3.3
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 12,254 mPa.s
Chemical Properties
Moisture absorption 0.43 %
Mechanical Properties
Shear strength
Shear Strength @25°C 8.15 N/mm2
Shear Strength @250°C 3.67 N/mm2
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C 6,0 N/mm2
Tensile Modulus @150°C 2,71 N/mm2
Tensile Modulus @25°C 2,77 N/mm2
Tensile Modulus @250°C 3 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 345 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 -55.5 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 0.2 W/m.K