LOCTITE ABLESTIK ABP2034

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features

Ultra low modulus
High adhesion
Low temperature cure

Product Description

LOCTITE ABLESTIK ABP 2034 low temperature cure, electrically conductive adhesive is designed for use in applications requiring low modulus and high adhesion strength.

LOCTITE ABLESTIK ABP 2034 (Ag filled BMI hybrid) is developed for conductive bonding in high-volume consumer devices. Both show excellent adhesion in interfaces such as SUS and Nickel in heat sensitive applications such as bracket grounding and VCM assembly for Camera modules. It can be used for batteries that require curing temperatures below 80° or even 60°C.

Cure Schedule

120 minutes @ 80°C

Specifications
Additional Information

Technical Specifications

General Properties

Work life @25°C

Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.

24 hours

Physical Properties

Thixotropic index

Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.

6.6

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

32,000 mPa.s

Mechanical Properties

Tensile Modulus

Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.

Tensile Modulus @25°C

82 N/mm2

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

1.2x10^-3 Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	46 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	120 ppm/°C

Additional Information

What are the outgassing expectations of ABP2034?

The expected weight loss for this material after 2hrs at 80°C is 1.4%. From experience with other silver filled adhesives we know that Total Mass Loss (TML) will be far below 1% AFTER cure. We do not have Collected Volatile Condensable Materials (CVCM) data, but do expect this to be below 0.1% based on comparable materials. We recommend you measure the outgassing of cured ABP 2034 YOURSELVES if this is critical for your application. If needed, applying a longer post bake after cure can be considered to further reduce the outgassing after cure.

WEIGHT LOSS OF ABP2034 AT 80°C

Can ABP2034 be used for cryogenic applications?

ABP 2034 has proved to be best performing down to -269°C (dipping in Helium) on larger parts. Of course, this will depend on the metal type and substrate finish of the sensors. This very low modulus and low temp (80°C) curable ECA is typically tested for small sensors, so you must check if the adhesion is strong enough at wire bonding temperatures.

An alternative could be ICP 2120 which has a higher modulus for wire bonding, but where we don't have enough data for cryogenic temperatures.