LOCTITE ABLESTIK ACP 3122

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features

Conductive only in z axis
Anisotropic electrically conductive
Low temperature cure

Product Description

This product has limited availability for niche applications. It is listed as No longer available but please reach out to us if there is demand for high quantities that cannot be achieved by Film factors.

LOCTITE® ABLESTIK ACP 3122 is an anisotropic epoxy adhesive designed for high throughput microelectronics assembly applications. This adhesive conducts in only one direction, making it suitable for small die and component attachment without the possibility of electrical shorting. ACP-3122 requires pressure during cure to establish a reliable interconnect.

Even though it is listed as an Underfill, LOCTITE® ABLESTIK ACP 3122 can also be used to bond a die, facilitate electrical connections under the bumps and (finally, as an underfill) destress the area around the bumps. So it goes without saying that it is a multi purpose product. Anisotropic pastes & films work well over a limited operating temperature range. If you are looking to operate outside of the range of -40°C/+125°C (or maybe even -40°C/+ 90°C) then there could be some issues with reliability that need to be tested.

Cure Schedule

5 seconds @ 150°C under optimum pressure, bondline temperature

LOCTITE ABLESTIK ACP 3122 requires pressure during cure to establish a reliable connection. Most dies up to 1 sq mm in size require a 1 to 3 Newtons to form a reliable interconnect. The optimum pressure is best determined for each new design. The recommended bonding condition for this adhesive is 5 seconds at a bondline temperature of 150ºC. No post cure is required. Material properties will depend upon cure conditions used

Specifications

Technical Specifications

General Properties

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -20°C	180 days

Work life @25°C

Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.

24 hours

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

22,000 mPa.s

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

100 °C