LOCTITE ABLESTIK ATB 125GR

Harmonization Code : 3920.99.28.90 |   Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
  • Low ionic content
  • Excellent adhesion on both metal lead frames and BGAs
  • High modulus

Product Description

LOCTITE ABLESTIK ATB 125GR adhesive film is formulated for use in wafer lamination processess or as a preform decal. ABLESTIK ATB 125GR is a new non-conductive die attach adhesive film suitable for use on small to medium size die sizes, with improved reliability on 0.5×.5 to 3×3 mm die size running in volume production.

LOCTITE ABLESTIK ATB 125GR has an integratedd icing tape designed for consistent die pick up.

Product Family
ATB125GR  
12 inch circles
25

Catalog Product

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Technical Specifications

General Properties
Adhesive Thickness
Adhesive Thickness
Adhesive thickness indicates the thickness of an adhesive layer.

It refers to the adhesive thickness of a single side so for double sided tapes it always needs to be multiplied.
25 µm
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
60 hours
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
0.6 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
0 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
0.2 ppm
Moisture absorption 1.53 %
Mechanical Properties
Shear strength
Shear Strength @250°C 129.5 N/mm2
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C 5,385 N/mm2
Tensile Modulus @150°C 281 N/mm2
Tensile Modulus @200°C 177 N/mm2
Tensile Modulus @25°C 3,205 N/mm2
Tensile Modulus @250°C 127 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
36 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
140 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
82-306 °C

Additional Information

 

Properties of ATB 125GR versus ATB F125E

Properties of ATB 125GR versus ATB F125E

Recommended Cure Schedule

  • 1 hour @175℃

Directions for Use

  1. Ensure all surfaces to be bonded are free from surface contamination.
  2. Adhesive must be completely used within the product's recommended work life.
  3. Remove the tape reel from the moisture-resistant package and load into the tape application machine.
  4. Store unused adhesive film in the original sealed moisture-resistant package until needed.