LOCTITE ABLESTIK ATB F150E


Main features
  • 50um
  • Non Conductive
  • Wafer lamination and Chip on chip

Product Description

LOCTITE® ABLESTIK ATB F150E High Modulus non conductive die Attach Film is a 2-in-1 (“precut”) format designed for Small Die applications like DFN, QFN, MLP, SOIC and Sensors moving to thin wafer (<100um). It has a low CTE of 37 ppm, high Tg of 215°C and bulk thermal conductivity of ~0.6 W/mK and is formulated for use in wafer lamination and chip on chip processes or as a preform decal. It is good for thin die pickup and wire penetration and excellent for various filler sizes ranging from 25 to 75um depending on the film thickness. An interesting tidbit is that when you want to reach higher thicknesses, that don't exist in the product portfolio, you can stack 2 layers of a film to get to the desired thickness

LOCTITE® ABLESTIK ATB F150E adhesive film has a thickness of 50um but it is also available in 25 and 75um. The single layer 50um die attach film on special UV dicing tape is suitable for die size range from 0.3x0.3mm to 3x3mm. It performs excellently for die pickup without die fly and re-attach down to 0.3mm die size and for fast die placement (30-100ms) up to 9 months after lamination. Additionally it passes MSL1 up to 2x2mm die.

Cure Schedule

  • 1 hour @ 130°C

UV Light

  • UV Wavelength, nm (UVA) 365
  • UVA Dosage, mJ/cm² 50 to 100
Product Family
ATBF150E  
8 inch circles 12 inch circles
25

No longer available

This product is no longer available or will become obsolete soon. Please contact us so we can recommend an alternative product.
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Adhesive Thickness
Adhesive Thickness
Adhesive thickness indicates the thickness of an adhesive layer.

It refers to the adhesive thickness of a single side so for double sided tapes it always needs to be multiplied.
 50 µm
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
 2880 hours
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 365 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 19 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
 1 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 2 ppm
Mechanical Properties
Shear strength
Shear Strength @250°C 4.8 N/mm2
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C 9,755 N/mm2
Tensile Modulus @150°C 1,092 N/mm2
Tensile Modulus @25°C 5,256 N/mm2
Tensile Modulus @250°C 185 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 37 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 83 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 215 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 0.6 W/m.K