LOCTITE ECCOBOND 50300LT

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features

High wire profile
Less thixotropic
Glob top

Product Description

LOCTITE ECCOBOND 50300LT glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use.

LOCTITE ECCOBOND 50300LT is recommended for use large ICs with high wire profile. It is the less thixotropic version of LOCTITE ECCOBOND 50300HT and LOCTITE ECCOBOND 50300-1.

Cure Schedule

2 hours @ 150°C

Low Stress Cure Schedule

1 hour @ 120°C + 1 hour @ 150°C

For best results, substrate should be preheated (up to a maximum of 70ºC) to obtain the optimum flow under and around the wires.

Specifications

Technical Specifications

General Properties

Pot Life

Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.

168 hours

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C	122 days

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

55 mPa.s

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	10 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	10 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	10 ppm

Thermal Properties

Coefficient of Thermal Expansion (CTE)

Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.

Coefficient of Thermal Expansion (CTE), α1

Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.

20 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

140 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.63 W/m.K