LOCTITE ECCOBOND FP4450HF

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features

Excellent corrosion resistance
Low filler size
Self levelling - Low alpha

Product Description

LOCTITE® ECCOBOND FP4450HF Fill encapsulant is designed for protection of bare semiconductor devices. Autoclave performance on live devices is greater than 1,000 hours with no failure, depending upon device and package type. The use of synthetic fused silica yields very low alpha particle emissions suitable for memory devices. A cavity or potting dam is required for flow control.

LOCTITE® ECCOBOND FP4450HF is a higher Tg version with a much lower filler cut size of 25um. It is admittedly a better product than FP4450, but much newer and therefore comes in lower package volumes and the price is slightly higher. Moisture uptake is expected to be comparable to FP4450. Its fine filler size, along with the lower viscosity make it indeed a "HF" High flow product.

Recommended Cure Schedule

30 minutes @ 125°C plus
90 minutes @ 165°C

Product Family
FP4450HF

1. Select Package Type

10cc Syringe 30cc Syringe 6oz Cartridge

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

In stock

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Filler Content

73 %

Pot Life

Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.

96 hours

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.79

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C	274 days

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

32,000 mPa.s

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	2 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	1 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	1 ppm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	10000 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	115 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	21 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	72 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 121°C / 250°F	12 minutes

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

164 °C

Other Properties

MSL Level

MSL 3

Additional Information

How does this product fare compared to the rest of the close FP family?

FP 4450HF resin system is closest to 4450 and we can consider 4450HF as smaller filler particle size version of 4450 (

We have internal information showing that these legacy semiconductor liquids pass UL94HB at 1/8” thickness but do not have the test data or yellow card nor are we going to test for it. This is anecdotal but, hopefully, helpful.