LOCTITE ECCOBOND FP4802

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features

High purity
Excellent flow
Phenolic encapsulant

Product Description

LOCTITE® ECCOBOND FP4802 is a high purity, liquid, phenolic encapsulant designed for use in applications utilizing lead-free solder. This low warpage product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C.

LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control.

LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).

Cure Schedule

60minutes @ 120°C plus 120minutes @ 165°C
30minutes @ 125°C plus 90minutes @ 165°C

Do not cure with a ramp rate >10°C/minute.

Product Family
FP4802

1. Select Package Type

30cc Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Pot Life

Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.

8 hours

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.76

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C	274 days

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

80,000 mPa.s

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	5 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	5 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	5 ppm

Mechanical Properties

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	120 N/mm2

Tensile Modulus

Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.

Tensile Modulus @25°C

13,000 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	20 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	100 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 121°C / 250°F	20 minutes

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

50 °C

Other Properties

MSL Level

MSL 2

Additional Information

LOCTITE ECCOBOND FP4803 is now about to be introduced into the European market. The FP 4803 has been developed for high-volume automotive camera modules and passed all required tests. It claims all the features of 4802 plus a much lower CTE.