LOCTITE HF 212

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • 90ISC and 97SC Alloys
  • Halogen free
  • Stencil Printable

Product Description

LOCTITE HF 212 solder paste is a halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste for PCB assembly. It is ideal for printing, with a fine pitch capability (0.3 mm), stencil life (>8 hours), and abandon time (>4 hours) that are suitable for high-speed printing up to 150 mm/s. Additionally it is solderable on challenging surface finishes (CuNiZn and Copper OSP) and leaves clear residues for easy post-reflow inspection.

LOCTITE HF 212 shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP-Cu, ENIG and CuNiZn.It is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC. It uses a halogen-free flux that passes IC with pretreatment IPC-TM-650 2.3.34/EN14582 and has a classification of ROL0 to ANSI/J-STD-004 Rev.B

Please note that HF 212 comes in multiple alloys and powder types. The specifications below are for 90iSC Alloy. Please advise the TDS for additional information.

 

Product Family
HF212  
90 iSC 97SC
0.5Kg Jar 0.6Kg Cartridge

No longer available

This product is no longer available or will become obsolete soon. Please contact us so we can recommend an alternative product.
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Alloy Type
Alloy Type
A metallic element type
 90iSC
Metal Loading
Bismuth (Bi)
Bismuth (Bi)
Bismuth is a chemical element with symbol Bi and atomic number 83. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.
 3 %
Copper (Cu)
Copper (Cu)
Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
 0.7 %
Silver (Ag) 3.8 %
Tin (Sn) 90.95 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 180 days
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 0.5
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 175000 mPa.s
Thermal Properties
Melting Temperature
Melting temperature 205 - 218 °C

Additional Information

Solder Alloys (J-STD 006)

Code Allloy Melting point Ag%
SAC0307 Low Silver 217 to 226 0.3
90iSC High Reliability 205 to 218 3.8
96S Industry Standard 221 3.5
96SC Industry Standard 217 3.8
97SC Industry Standard 217 3.0