MH20-2000 Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

MH20-2000 CTE-matched for copper, bronze & CuSn6 Applications

MH20-2000 Desgined for automotive copper parts to pass AEC-Q200 Specification

Main features

Black epoxy mold compound
Transfer molding
Class B (130°C)

Product Description

High temperature resistant epoxy mold compound designed for encapsulation of automotive copper parts tested to AEC-Q200 specification

MH20-2000 is a very tough epoxy mold compound with excellent high temperature resistance. It is designed for automotive applications that require thermoset epoxies instead of thermoplastics to meet higher performance requirements and AEC-Q200 specification.

MH20-2000 is used on devices that have operating temperature above 200°C. It is CTE matched to copper, CuSn6 and bronze.

MH20-2000 works equally well on tin-plated copper applications. Adhesion to these substrates has been tested extensively.

Main Applications

Thermal Fuses
Tin-plated Copper parts
Smaller parts designed to meet automotive requirements

Product Features & Benefits:

Very tough epoxy mold compound
High Tg compound designed for higher temperature applications
Used on devices with an operating temperature up to 200°C

Used on underhood automotive and other high temperature applications requiring a high glass transition temperature and great thermal cycle resistance from -55°C to 125°C.

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

80 %

Process Method

Transfer Molding

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.83

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	365 days

Physical Properties

Spiral Flow @ 175°C

86 cm

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	20 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	20 ppm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	16800 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	157 N/mm2

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C	90

Molded Shrinkage

0.24 %

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

4.4x10¹⁷ Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	15 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	45 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	23 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

175 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.5 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

Class B (130°C)

Other Properties

RoHS Compliant

RoHS Compliant
RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).

Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions

Yes

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F	70 - 90 s
Curing Time @ 175°C / 347°F (Automold)	50 - 70 s
Mold Temperature	140 - 180 °C
Preheat Temperature	80 - 95 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	2 - 6 hrs

Transfer Pressure

40 - 85 kg/cm2

Transfer Time

6 - 15 s

Additional Information

Pricing & Availability

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Pricing and Volume Price Breaks for MH20-2000 Black Epoxy Mold Compound are available by contacting us. You cannot order this product directly online. CAPLINQ lists all its prices without taxes, shipping payment charges or discounts. CAPLINQ has warehouses and ships from both Canada and the Netherlands, and if your shipping address is one of these two countries, applicable taxes will be applied. If your shipping address is to the United States, we request your company’s Employer Identification Number (EIN) or Tax Identification Number (TIN). This is a unique 9-digit number assigned by the IRS and is required for all cross-border shipments. Failure to provide this number could result in delays to your order. If your shipping address is within the EU, but outside the Netherlands, then we are required to request your company's Value Added Tax (VAT, BTW, MwSt) number to be able to ship the goods tax-free. For all other countries, no taxes are levied on your orders. DON'T LIKE THESE PRICES? Tell us what you will pay for what order quantity, and our customer service team will get back tou you within 24 hours with a reply.. Minimum Order Quantity for MH20-2000 Black Epoxy Mold Compound The minimum order quantity for this package size is (s). Shipping Charges for MH20-2000 Black Epoxy Mold Compound All prices shown are ex-works CAPLINQ, but during the checkout process, you will be given several shipping options including Canada Post, TNT, UPS or the choice of using your own freight forwarder. Depending on your shipping address, the shipping charges will be calculated as follows: Europe, Middle East, Asia and Africa: Shipping from CAPLINQ Europe BV (Amsterdam, the Netherlands) Canada, USA, Mexico and South America: Shipping from CAPLINQ Corporation (Ottawa, Canada) Payment option for MH20-2000 Black Epoxy Mold Compound During the checkout process, you will be presented with several payment options including: Credit Card (We accept VISA and Mastercard) Bank Transfer (You will be given the payment instructions at the time of order placement) PayPal (Where you can also pay with American Express Cards) Purchase Order (You must be preapproved first. See our Online Credit Application) Availability for MH20-2000 Black Epoxy Mold Compound To the right of the product is a small icon that lets you know the availability and leadtime of the product. This leadtime is the time to ship the product and delivery times vary based on the method of delivery you select at the time you place your order. Contact us if anything is unclear or you need more assistance.

Technical Specifications

Short Description of MH20-2000 Black Epoxy Mold Compound
Typical applications and uses of MH20-2000 Black Epoxy Mold Compound include: Electrical Insulation Motor Irons Bus Bars Technical Datasheets for MH20-2000 Black Epoxy Mold Compound TDS (English) Click to access MH20-2000 Black Epoxy Mold Compound Technical Data Sheet *Note that only registered users may access technical datasheets

Competitive Crossovers

Compare price and quality of MH20-2000 Black Epoxy Mold Compound to these other brands
Popular Brand¹ Names	Product Description	CAPLINQ Part#
Pelnox PCE-282	High temperature resistant epoxy mold compound designed for encapsulation of automotive copper parts tested to AEC-Q200 specification MH20-2000 is a very tough epoxy mold compound with excellent high temperature resistance. It is designed for automotive applications that require thermoset epoxies instead of thermoplastics to meet higher performance requirements and AEC-Q200 specification. MH20-2000 is used on devices that have operating temperature above 200°C. It is CTE matched to copper, CuSn6 and bronze. MH20-2000 works equally well on tin-plated copper applications. Adhesion to these substrates has been tested extensively. Main Applications Thermal Fuses Tin-plated Copper parts Smaller parts designed to meet automotive requirements Product Features & Benefits: Very tough epoxy mold compound High Tg compound designed for higher temperature applications Used on devices with an operating temperature up to 200°C Designed for excellent adhesion and CTE-matched to copper, CuSn6 and bronze. Used on underhood automotive and other high temperature applications requiring a high glass transition temperature and great thermal cycle resistance from -55°C to 125°C.	MH20-2000 Black Epoxy Mold Compound

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Additional Information

Additional Information about MH20-2000 Black Epoxy Mold Compound

Harmonization Code
- Customs Harmonization Code (HTS#) for MH20-2000 Black Epoxy Mold Compound
  
  3907.30.00.90 |
Additional Information

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Product Reviews for MH20-2000 Black Epoxy Mold Compound

Packaging Details

Packaging Details for MH20-2000 Black Epoxy Mold Compound
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